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What are the packaging methods of LED?
- Categories:Industry News
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- Time of issue:2019-07-16 08:39
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(Summary description)Tools/rawmaterials Wafer,goldwire,bracket,silverglue,resin,dispensingmachine,wireweldingmachine,oven...etc. Method/Step1: Lamp-LED(VerticalLED) Lamp-LEDisadirect-plugLEDinitsearlystage.Itsencapsulationusesencapsulationmethod.ThefillingprocessistoinjectliquidepoxyresinintothecavityoftheLEDformingdie,thenpenetratethepressureweldedLEDbracket,putitintotheoventocuretheepoxyresin,andthenseparatetheLEDfromthecavityandformit.Becausethemanufacturingprocessisrelativelysimpleandlowcost,ithasahighmarketshare.SMD-LED(AppearanceMountedLED) ThepatchLEDisaffixedtothePCBsurface,suitableforSMTprocessingandreflowsoldering.Itcanwelldealwiththeproblemsofbrightness,angleofview,smoothness,reliabilityandconsistency.ThelighterPCBboardandreflectivelayerdataareselected.Afterimprovement,theheaviercarbonsteeldatapinsofthedirect-insertedLEDareremoved,sothattheepoxytreewhichneedsfillinginthereflectivelayerisdisplayed.Fatless,theintentionistoreducethescale,reducethecomponent.Inthisway,theappearancemountedLEDcaneasilyreducetheproductweightbyhalf,andultimatelymaketheapplicationmorecomplete. Method/Step2: Side-LED(SideLightEmittingLED) Atpresent,anotherkeypointofLEDpackagingislight-emittingpackagingontheside.IfyouwanttouseLEDasbacklightsourceofLCD(liquidcrystaldisplay),thenthesidelightofLEDneedstobethesameastheexternallight,sothatthebacklightofLCDcanbeuniform.Althoughtheuseofwirerackdescription,canalsoreachthesideoftheintentofluminescence,buttheroleofheatdissipationisnotgood.However,Lumiledscreatedamirrordescription,usingthemirrorprincipletogeneratesidelight,andsuccessfullyappliedhigh-powerLEDstolarge-scaleLCDbacklightmodules. Method/Step3: TOP-LED(TopLightEmittingLED) Toplight-emittingdiodesarecomparabletocommonpatchlight-emittingdiodes.Mainlyusedinmulti-functionalultra-thinmobilephonesandPDAbacklightsandstatusindicators. Method/Step4: High-Power-LED InordertoobtainhighpowerandhighbrightnessLEDlightsource,manufacturersaredevelopinginthedirectionofhighpowerinthedescriptionofLEDchipsandpackaging.Atpresent,LEDpackagesthatcanacceptseveralWpowerhavebeenpresented.Forexample,thepackaginglayoutofNorluxserieshigh-powerLEDisamulti-chipcombinationofhexagonalaluminiumplateasthebase(makingitnon-conductive).Thebasediameteris31.75mm.Theluminousregionislocatedatthecenterofthebase.Itsdiameterisabout(0.375*25.4)mm.Itcancontain40LEDtubecores.Thealuminiumplateisalsousedasheatsink.Thiskindofpackageusesconventionalhighdensitypackagewithtubecore.Ithashighluminouspower,lowthermalresistanceandhighopticaloutputpowerunderhighcurrent.ItisalsoakindofLEDsolidstatelightsourcewithabrightfuture. ItcanbeseenthatthethermalcharacteristicsofpowerLEDdirectlyaffecttheworkingtemperature,light-emittingpower,light-emittingwavelengthandservicelifeoftheLED.Therefore,thepackagingdescriptionandmanufacturingskillsofpowerLEDchipsbecomemoreandmoreimportant. Method/Step5: FlipChip-LED ThelayoutofLEDcladdingpackagingisbasicallymadeofapluralityofperforationsinPCB.Eachperforationononesideofthesubstrateisequippedwithtwodifferentareasandopencircuitconductivematerials.Moreover,theconductivematerialsarelaidflatonthesurfaceofthesubstrate.TherearepluralityofunpackagedLEDchipsplacedoneachperforationonthesideoftheconductivematerial.Atthehole,thepositiveandnegativecontactsofasingleLEDchipareconnectedwithconductivematerialsonthesurfaceofthesubstrateusingtinballsseparately.OntheperforatedsideofthepluralLEDchips,thereisasealantwithclearmaterialsonthesurface.Thesealantisahalf-sphereshapeandsitsateachperforation.Itisattributedtoflip-chipweldinglayoutoflightemittingdiodes.
What are the packaging methods of LED?
(Summary description)Tools/rawmaterials Wafer,goldwire,bracket,silverglue,resin,dispensingmachine,wireweldingmachine,oven...etc. Method/Step1: Lamp-LED(VerticalLED) Lamp-LEDisadirect-plugLEDinitsearlystage.Itsencapsulationusesencapsulationmethod.ThefillingprocessistoinjectliquidepoxyresinintothecavityoftheLEDformingdie,thenpenetratethepressureweldedLEDbracket,putitintotheoventocuretheepoxyresin,andthenseparatetheLEDfromthecavityandformit.Becausethemanufacturingprocessisrelativelysimpleandlowcost,ithasahighmarketshare.SMD-LED(AppearanceMountedLED) ThepatchLEDisaffixedtothePCBsurface,suitableforSMTprocessingandreflowsoldering.Itcanwelldealwiththeproblemsofbrightness,angleofview,smoothness,reliabilityandconsistency.ThelighterPCBboardandreflectivelayerdataareselected.Afterimprovement,theheaviercarbonsteeldatapinsofthedirect-insertedLEDareremoved,sothattheepoxytreewhichneedsfillinginthereflectivelayerisdisplayed.Fatless,theintentionistoreducethescale,reducethecomponent.Inthisway,theappearancemountedLEDcaneasilyreducetheproductweightbyhalf,andultimatelymaketheapplicationmorecomplete. Method/Step2: Side-LED(SideLightEmittingLED) Atpresent,anotherkeypointofLEDpackagingislight-emittingpackagingontheside.IfyouwanttouseLEDasbacklightsourceofLCD(liquidcrystaldisplay),thenthesidelightofLEDneedstobethesameastheexternallight,sothatthebacklightofLCDcanbeuniform.Althoughtheuseofwirerackdescription,canalsoreachthesideoftheintentofluminescence,buttheroleofheatdissipationisnotgood.However,Lumiledscreatedamirrordescription,usingthemirrorprincipletogeneratesidelight,andsuccessfullyappliedhigh-powerLEDstolarge-scaleLCDbacklightmodules. Method/Step3: TOP-LED(TopLightEmittingLED) Toplight-emittingdiodesarecomparabletocommonpatchlight-emittingdiodes.Mainlyusedinmulti-functionalultra-thinmobilephonesandPDAbacklightsandstatusindicators. Method/Step4: High-Power-LED InordertoobtainhighpowerandhighbrightnessLEDlightsource,manufacturersaredevelopinginthedirectionofhighpowerinthedescriptionofLEDchipsandpackaging.Atpresent,LEDpackagesthatcanacceptseveralWpowerhavebeenpresented.Forexample,thepackaginglayoutofNorluxserieshigh-powerLEDisamulti-chipcombinationofhexagonalaluminiumplateasthebase(makingitnon-conductive).Thebasediameteris31.75mm.Theluminousregionislocatedatthecenterofthebase.Itsdiameterisabout(0.375*25.4)mm.Itcancontain40LEDtubecores.Thealuminiumplateisalsousedasheatsink.Thiskindofpackageusesconventionalhighdensitypackagewithtubecore.Ithashighluminouspower,lowthermalresistanceandhighopticaloutputpowerunderhighcurrent.ItisalsoakindofLEDsolidstatelightsourcewithabrightfuture. ItcanbeseenthatthethermalcharacteristicsofpowerLEDdirectlyaffecttheworkingtemperature,light-emittingpower,light-emittingwavelengthandservicelifeoftheLED.Therefore,thepackagingdescriptionandmanufacturingskillsofpowerLEDchipsbecomemoreandmoreimportant. Method/Step5: FlipChip-LED ThelayoutofLEDcladdingpackagingisbasicallymadeofapluralityofperforationsinPCB.Eachperforationononesideofthesubstrateisequippedwithtwodifferentareasandopencircuitconductivematerials.Moreover,theconductivematerialsarelaidflatonthesurfaceofthesubstrate.TherearepluralityofunpackagedLEDchipsplacedoneachperforationonthesideoftheconductivematerial.Atthehole,thepositiveandnegativecontactsofasingleLEDchipareconnectedwithconductivematerialsonthesurfaceofthesubstrateusingtinballsseparately.OntheperforatedsideofthepluralLEDchips,thereisasealantwithclearmaterialsonthesurface.Thesealantisahalf-sphereshapeandsitsateachperforation.Itisattributedtoflip-chipweldinglayoutoflightemittingdiodes.
- Categories:Industry News
- Author:
- Origin:
- Time of issue:2019-07-16 08:39
- Views:
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通用底部
-
About us
- Company profile Honor Plant
-
Products
- SMD LED Digital tube Triode ......
-
Talent
- Idea Recruitment
Service hotline

Copyright © Dongguan Taiming Photoelectric Technology Co., Ltd. All Rights Reserved. 粤ICP备15044056号-2
