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Analysis of Manufacturing Process and Testing Items of LED Chips
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Analysis of Manufacturing Process and Testing Items of LED Chips

  • Categories:Industry News
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  • Time of issue:2019-07-16 08:41
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(Summary description)ChipisthemostcriticalrawmaterialofLED.ItsqualitydirectlydeterminestheperformanceofLED.Especiallyforhigh-endLEDusedinautomotiveorsolid-statelightingequipment,thereisabsolutelynodefect,thatistosay,thereliabilityofsuchequipmentmustbeveryhigh.However,duetothelackofexperienceandequipmentinchipincominginspection,LEDpackagingfactoriesusuallydonotcarryoutincominginspectiononchips.Afterpurchasingunqualifiedchips,theyoftensufferfromdumblosses.OnthebasisofaccumulatingalargenumberoffailureanalysiscasesofLED,JinjianInspectionintroducesthebusinessofincominginspectionofLEDchips,andidentifiestheadvantagesanddisadvantagesofthechipsbyusinghigh-endanalyticalinstruments.ThistestingservicecanbeusedasasupplementtotheincominginspectionofLEDpackagingplant/chipagentfactory,topreventbadchipsfrombeingstoredinstorage,andtoavoidtheoveralllossoflampbeadscausedbychipqualityproblems.   Testingitems:   I.TestingofPerformanceParametersofChips   Wd(mainwavelength),Iv(brightness),Vf(forwardvoltage),Ir(leakage),ESD(antistaticability)andotherchipphotoelectricperformancetesting,Jinjianasathird-partytestingagencycanidentifywhethertheproductdataprovidedbysuppliersmeetthestandards.   II.ChipDefectFinding   Detectioncontent:   1.Chipsizemeasurement,chipsizeandelectrodesizemeettherequirements,whethertheelectrodepatterniscomplete.   2.Whetherthechiphasdefectssuchassolderjointcontamination,solderjointbreakage,grainbreakage,graincuttingsizedifference,graincuttinginclination,etc.   ThedamageoftheLEDchipwilldirectlyleadtothefailureoftheLED,soitisveryimportanttoimprovethereliabilityoftheLEDchip.Thespringclampissometimesusedtofixthechipintheevaporationprocess,sotheclampmarkswillbeproduced.Inyellowlightoperation,ifthedevelopmentisincompleteandthereareholesinthehood,therewillberesidualmetalintheluminousregion.Inthepreviousstageofgrainproduction,tweezers,flowerbasketandcarriermustbeusedinallprocessessuchascleaning,evaporation,yellowlight,chemicaletching,fusionandgrinding,soscratchingofgrainelectrodeswilloccur.   Theinfluenceofchipelectrodesonsolderjoints:theimproperevaporationofchipelectrodesleadstothelossordamageofelectrodesaftersolderingwires;thepoorsolderabilityofchipelectrodesleadstovirtualsolderingofsolderballs;improperstorageofchipleadstooxidationofelectrodesurface,surfacecontaminationandsoon.Theslightcontaminationofbondingsurfacemayaffectthemetaloriginbetweenthetwo.Subdiffusioncausesfailureorvirtualwelding.   3.DefectFindinginChipEpitaxyZone   Intheprocessofhightemperaturecrystallization,impuritieswillbeintroducedintothesubstrate,sedimentresidueintheMOCVDreactionchamber,peripheralgasandMosource.Theseimpuritieswillpenetrateintotheepitaxylayer,preventthenucleationofGaNcrystal,formvariousepitaxydefects,andeventuallyformtinypitsonthesurfaceofepitaxylayer,whichwillseriouslyaffecttheepitaxy.Crystalqualityandpropertiesofextendedfilmmaterials.Jinjianhasdevelopedafastdetectionmethodtoidentifythedefectsofchipepitaxy.Itcandetect80%ofthedefectsofchipepitaxylayeratlowcostandquickly,andhelpLEDcustomerschoosehighqualityepitaxychipsandchips.   4.Observationofchiptechnologyandcleanliness   ElectrodeprocessingisakeyprocessintheproductionofLEDchips,includingcleaning,evaporation,yellowlight,chemicaletching,fusion,grinding,willbeexposedtomanychemicalcleaningagents,ifthechipcleaningisnotcleanenough,willcauseharmfulchemicalresidues.TheseharmfulchemicalswillreactelectrochemicallywiththeelectrodeswhentheLEDiselectrified,leadingtodeadlights,lightdecay,dark,blackeningandotherphenomena.Therefore,theidentificationofchipchemicalresiduesisveryimportantforLEDpackagingplants.   Caseanalysis(1):   Acustomerredlightbulbfounddarkproblem,buthasbeenunabletofindthereason,commissionedJinjiananalysisofthereasonsforfailure.Aftereliminatingthepackagingreasonsthroughaseriesofinstrumentalanalysis,Jinjianinspectedthebarecrystalsprovidedbythesupplier.Itwasfoundthattherewerecontaminantsindifferentareasineachchip'sluminousregion.EnergyspectrumanalysisshowedthatthecontaminantscontainedCandOelements,indicatingthatthecontaminantswereorganic.Werecommendthatcustomerspayattentiontotheassessmentofchipmanufacturers'productionprocessspecificationsandworkshopenvironment,andstrengthentheinspectionofchipincomingmaterials.     Note:ManufacturingprocessofLEDchip       Epitaxialfilmcleaningcoatingoftransparentelectrodelayercoatingoftransparentelectrodelayerphotolithographyoftransparentelectrodepatterncorrosionde-coatingde-gluephotolitlithoglitlitlithoglitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitGrinding_Cutting_Chip_FinishedProductTesting.   Afterthegrowthoftheepitaxychip,thenextstepistomaketheelectrodesfortheLEDepitaxychip(Ppole,Npole),thencuttheLEDepitaxychipwithalaseroradiamondknife,makethechip,andthenextract

Analysis of Manufacturing Process and Testing Items of LED Chips

(Summary description)ChipisthemostcriticalrawmaterialofLED.ItsqualitydirectlydeterminestheperformanceofLED.Especiallyforhigh-endLEDusedinautomotiveorsolid-statelightingequipment,thereisabsolutelynodefect,thatistosay,thereliabilityofsuchequipmentmustbeveryhigh.However,duetothelackofexperienceandequipmentinchipincominginspection,LEDpackagingfactoriesusuallydonotcarryoutincominginspectiononchips.Afterpurchasingunqualifiedchips,theyoftensufferfromdumblosses.OnthebasisofaccumulatingalargenumberoffailureanalysiscasesofLED,JinjianInspectionintroducesthebusinessofincominginspectionofLEDchips,andidentifiestheadvantagesanddisadvantagesofthechipsbyusinghigh-endanalyticalinstruments.ThistestingservicecanbeusedasasupplementtotheincominginspectionofLEDpackagingplant/chipagentfactory,topreventbadchipsfrombeingstoredinstorage,andtoavoidtheoveralllossoflampbeadscausedbychipqualityproblems.   Testingitems:   I.TestingofPerformanceParametersofChips   Wd(mainwavelength),Iv(brightness),Vf(forwardvoltage),Ir(leakage),ESD(antistaticability)andotherchipphotoelectricperformancetesting,Jinjianasathird-partytestingagencycanidentifywhethertheproductdataprovidedbysuppliersmeetthestandards.   II.ChipDefectFinding   Detectioncontent:   1.Chipsizemeasurement,chipsizeandelectrodesizemeettherequirements,whethertheelectrodepatterniscomplete.   2.Whetherthechiphasdefectssuchassolderjointcontamination,solderjointbreakage,grainbreakage,graincuttingsizedifference,graincuttinginclination,etc.   ThedamageoftheLEDchipwilldirectlyleadtothefailureoftheLED,soitisveryimportanttoimprovethereliabilityoftheLEDchip.Thespringclampissometimesusedtofixthechipintheevaporationprocess,sotheclampmarkswillbeproduced.Inyellowlightoperation,ifthedevelopmentisincompleteandthereareholesinthehood,therewillberesidualmetalintheluminousregion.Inthepreviousstageofgrainproduction,tweezers,flowerbasketandcarriermustbeusedinallprocessessuchascleaning,evaporation,yellowlight,chemicaletching,fusionandgrinding,soscratchingofgrainelectrodeswilloccur.   Theinfluenceofchipelectrodesonsolderjoints:theimproperevaporationofchipelectrodesleadstothelossordamageofelectrodesaftersolderingwires;thepoorsolderabilityofchipelectrodesleadstovirtualsolderingofsolderballs;improperstorageofchipleadstooxidationofelectrodesurface,surfacecontaminationandsoon.Theslightcontaminationofbondingsurfacemayaffectthemetaloriginbetweenthetwo.Subdiffusioncausesfailureorvirtualwelding.   3.DefectFindinginChipEpitaxyZone   Intheprocessofhightemperaturecrystallization,impuritieswillbeintroducedintothesubstrate,sedimentresidueintheMOCVDreactionchamber,peripheralgasandMosource.Theseimpuritieswillpenetrateintotheepitaxylayer,preventthenucleationofGaNcrystal,formvariousepitaxydefects,andeventuallyformtinypitsonthesurfaceofepitaxylayer,whichwillseriouslyaffecttheepitaxy.Crystalqualityandpropertiesofextendedfilmmaterials.Jinjianhasdevelopedafastdetectionmethodtoidentifythedefectsofchipepitaxy.Itcandetect80%ofthedefectsofchipepitaxylayeratlowcostandquickly,andhelpLEDcustomerschoosehighqualityepitaxychipsandchips.   4.Observationofchiptechnologyandcleanliness   ElectrodeprocessingisakeyprocessintheproductionofLEDchips,includingcleaning,evaporation,yellowlight,chemicaletching,fusion,grinding,willbeexposedtomanychemicalcleaningagents,ifthechipcleaningisnotcleanenough,willcauseharmfulchemicalresidues.TheseharmfulchemicalswillreactelectrochemicallywiththeelectrodeswhentheLEDiselectrified,leadingtodeadlights,lightdecay,dark,blackeningandotherphenomena.Therefore,theidentificationofchipchemicalresiduesisveryimportantforLEDpackagingplants.   Caseanalysis(1):   Acustomerredlightbulbfounddarkproblem,buthasbeenunabletofindthereason,commissionedJinjiananalysisofthereasonsforfailure.Aftereliminatingthepackagingreasonsthroughaseriesofinstrumentalanalysis,Jinjianinspectedthebarecrystalsprovidedbythesupplier.Itwasfoundthattherewerecontaminantsindifferentareasineachchip'sluminousregion.EnergyspectrumanalysisshowedthatthecontaminantscontainedCandOelements,indicatingthatthecontaminantswereorganic.Werecommendthatcustomerspayattentiontotheassessmentofchipmanufacturers'productionprocessspecificationsandworkshopenvironment,andstrengthentheinspectionofchipincomingmaterials.     Note:ManufacturingprocessofLEDchip       Epitaxialfilmcleaningcoatingoftransparentelectrodelayercoatingoftransparentelectrodelayerphotolithographyoftransparentelectrodepatterncorrosionde-coatingde-gluephotolitlithoglitlitlithoglitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitGrinding_Cutting_Chip_FinishedProductTesting.   Afterthegrowthoftheepitaxychip,thenextstepistomaketheelectrodesfortheLEDepitaxychip(Ppole,Npole),thencuttheLEDepitaxychipwithalaseroradiamondknife,makethechip,andthenextract

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2019-07-16 08:41
  • Views:
Information
Chip is the most critical raw material of LED. Its quality directly determines the performance of LED. Especially for high-end LED used in automotive or solid-state lighting equipment, there is absolutely no defect, that is to say, the reliability of such equipment must be very high. However, due to the lack of experience and equipment in chip incoming inspection, LED packaging factories usually do not carry out incoming inspection on chips. After purchasing unqualified chips, they often suffer from dumb losses. On the basis of accumulating a large number of failure analysis cases of LED, Jinjian Inspection introduces the business of incoming inspection of LED chips, and identifies the advantages and disadvantages of the chips by using high-end analytical instruments. This testing service can be used as a supplement to the incoming inspection of LED packaging plant/chip agent factory, to prevent bad chips from being stored in storage, and to avoid the overall loss of lamp beads caused by chip quality problems.
 
 
 
Testing items:
 
 
 
I. Testing of Performance Parameters of Chips
 
 
 
Wd (main wavelength), Iv (brightness), Vf (forward voltage), Ir (leakage), ESD (antistatic ability) and other chip photoelectric performance testing, Jinjian as a third-party testing agency can identify whether the product data provided by suppliers meet the standards.
 
 
 
II. Chip Defect Finding
 
 
 
Detection content:
 
 
 
1. Chip size measurement, chip size and electrode size meet the requirements, whether the electrode pattern is complete.
 
 
 
2. Whether the chip has defects such as solder joint contamination, solder joint breakage, grain breakage, grain cutting size difference, grain cutting inclination, etc.
 
 
 
The damage of the LED chip will directly lead to the failure of the LED, so it is very important to improve the reliability of the LED chip. The spring clamp is sometimes used to fix the chip in the evaporation process, so the clamp marks will be produced. In yellow light operation, if the development is incomplete and there are holes in the hood, there will be residual metal in the luminous region. In the previous stage of grain production, tweezers, flower basket and carrier must be used in all processes such as cleaning, evaporation, yellow light, chemical etching, fusion and grinding, so scratching of grain electrodes will occur.
 
 
 
The influence of chip electrodes on solder joints: the improper evaporation of chip electrodes leads to the loss or damage of electrodes after soldering wires; the poor solderability of chip electrodes leads to virtual soldering of solder balls; improper storage of chip leads to oxidation of electrode surface, surface contamination and so on. The slight contamination of bonding surface may affect the metal origin between the two. Subdiffusion causes failure or virtual welding.
 
 
 
3. Defect Finding in Chip Epitaxy Zone
 
 
 
In the process of high temperature crystallization, impurities will be introduced into the substrate, sediment residue in the MOCVD reaction chamber, peripheral gas and Mo source. These impurities will penetrate into the epitaxy layer, prevent the nucleation of GaN crystal, form various epitaxy defects, and eventually form tiny pits on the surface of epitaxy layer, which will seriously affect the epitaxy. Crystal quality and properties of extended film materials. Jinjian has developed a fast detection method to identify the defects of chip epitaxy. It can detect 80% of the defects of chip epitaxy layer at low cost and quickly, and help LED customers choose high quality epitaxy chips and chips.
 
 
 
4. Observation of chip technology and cleanliness
 
 
 
Electrode processing is a key process in the production of LED chips, including cleaning, evaporation, yellow light, chemical etching, fusion, grinding, will be exposed to many chemical cleaning agents, if the chip cleaning is not clean enough, will cause harmful chemical residues. These harmful chemicals will react electrochemically with the electrodes when the LED is electrified, leading to dead lights, light decay, dark, blackening and other phenomena. Therefore, the identification of chip chemical residues is very important for LED packaging plants.
 
 
 
Case analysis (1):
 
 
 
A customer red light bulb found dark problem, but has been unable to find the reason, commissioned Jinjian analysis of the reasons for failure. After eliminating the packaging reasons through a series of instrumental analysis, Jinjian inspected the bare crystals provided by the supplier. It was found that there were contaminants in different areas in each chip's luminous region. Energy spectrum analysis showed that the contaminants contained C and O elements, indicating that the contaminants were organic. We recommend that customers pay attention to the assessment of chip manufacturers'production process specifications and workshop environment, and strengthen the inspection of chip incoming materials.
 
 
 
 
 
Note: Manufacturing process of LED chip
 
 
 
 
 
 
 
Epitaxial film cleaning coating of transparent electrode layer coating of transparent electrode layer photolithography of transparent electrode pattern corrosion de-coating de-glue photolitlithoglitlitlithoglitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitGrinding _Cutting_Chip_Finished Product Testing.
 
 
 
After the growth of the epitaxy chip, the next step is to make the electrodes for the LED epitaxy chip (P pole, N pole), then cut the LED epitaxy chip with a laser or a diamond knife, make the chip, and then extract nine points from different positions of the wafer for parameter testing. This is mainly to test the voltage, wavelength and brightness. Wafers that meet the normal shipping standard parameters will continue to operate next step. If they do not meet the requirements, they will be put aside for further processing. After the wafer is cut into chips, 100% visual inspection (VI/VC) is required, and the operator needs to make visual inspection under a 30-fold magnification microscope. Then, the chip is automatically selected, tested and classified by using automatic classifier according to different voltage, wavelength and brightness prediction parameters. Finally, the LED chip is inspected (VC) and labeled. The chip type, batch number, quantity and photoelectric measurement statistics are recorded on the label and attached to the back of the waxed paper. The chip on the blue film will do the final visual inspection test. The visual inspection standard is the same as the first one to ensure the chip array.

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Time of issue:2019-05-17 00:00:00

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通用底部

Time of issue:2019-05-17 00:00:00

Service hotline

0769-87285383

Welcome your consultation!

Messages

xh

Copyright © Dongguan Taiming Photoelectric Technology Co., Ltd. All Rights Reserved. 粤ICP备15044056号-2

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