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Analysis of Manufacturing Process and Testing Items of LED Chips
- Categories:Industry News
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- Time of issue:2019-07-16 08:41
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(Summary description)ChipisthemostcriticalrawmaterialofLED.ItsqualitydirectlydeterminestheperformanceofLED.Especiallyforhigh-endLEDusedinautomotiveorsolid-statelightingequipment,thereisabsolutelynodefect,thatistosay,thereliabilityofsuchequipmentmustbeveryhigh.However,duetothelackofexperienceandequipmentinchipincominginspection,LEDpackagingfactoriesusuallydonotcarryoutincominginspectiononchips.Afterpurchasingunqualifiedchips,theyoftensufferfromdumblosses.OnthebasisofaccumulatingalargenumberoffailureanalysiscasesofLED,JinjianInspectionintroducesthebusinessofincominginspectionofLEDchips,andidentifiestheadvantagesanddisadvantagesofthechipsbyusinghigh-endanalyticalinstruments.ThistestingservicecanbeusedasasupplementtotheincominginspectionofLEDpackagingplant/chipagentfactory,topreventbadchipsfrombeingstoredinstorage,andtoavoidtheoveralllossoflampbeadscausedbychipqualityproblems. Testingitems: I.TestingofPerformanceParametersofChips Wd(mainwavelength),Iv(brightness),Vf(forwardvoltage),Ir(leakage),ESD(antistaticability)andotherchipphotoelectricperformancetesting,Jinjianasathird-partytestingagencycanidentifywhethertheproductdataprovidedbysuppliersmeetthestandards. II.ChipDefectFinding Detectioncontent: 1.Chipsizemeasurement,chipsizeandelectrodesizemeettherequirements,whethertheelectrodepatterniscomplete. 2.Whetherthechiphasdefectssuchassolderjointcontamination,solderjointbreakage,grainbreakage,graincuttingsizedifference,graincuttinginclination,etc. ThedamageoftheLEDchipwilldirectlyleadtothefailureoftheLED,soitisveryimportanttoimprovethereliabilityoftheLEDchip.Thespringclampissometimesusedtofixthechipintheevaporationprocess,sotheclampmarkswillbeproduced.Inyellowlightoperation,ifthedevelopmentisincompleteandthereareholesinthehood,therewillberesidualmetalintheluminousregion.Inthepreviousstageofgrainproduction,tweezers,flowerbasketandcarriermustbeusedinallprocessessuchascleaning,evaporation,yellowlight,chemicaletching,fusionandgrinding,soscratchingofgrainelectrodeswilloccur. Theinfluenceofchipelectrodesonsolderjoints:theimproperevaporationofchipelectrodesleadstothelossordamageofelectrodesaftersolderingwires;thepoorsolderabilityofchipelectrodesleadstovirtualsolderingofsolderballs;improperstorageofchipleadstooxidationofelectrodesurface,surfacecontaminationandsoon.Theslightcontaminationofbondingsurfacemayaffectthemetaloriginbetweenthetwo.Subdiffusioncausesfailureorvirtualwelding. 3.DefectFindinginChipEpitaxyZone Intheprocessofhightemperaturecrystallization,impuritieswillbeintroducedintothesubstrate,sedimentresidueintheMOCVDreactionchamber,peripheralgasandMosource.Theseimpuritieswillpenetrateintotheepitaxylayer,preventthenucleationofGaNcrystal,formvariousepitaxydefects,andeventuallyformtinypitsonthesurfaceofepitaxylayer,whichwillseriouslyaffecttheepitaxy.Crystalqualityandpropertiesofextendedfilmmaterials.Jinjianhasdevelopedafastdetectionmethodtoidentifythedefectsofchipepitaxy.Itcandetect80%ofthedefectsofchipepitaxylayeratlowcostandquickly,andhelpLEDcustomerschoosehighqualityepitaxychipsandchips. 4.Observationofchiptechnologyandcleanliness ElectrodeprocessingisakeyprocessintheproductionofLEDchips,includingcleaning,evaporation,yellowlight,chemicaletching,fusion,grinding,willbeexposedtomanychemicalcleaningagents,ifthechipcleaningisnotcleanenough,willcauseharmfulchemicalresidues.TheseharmfulchemicalswillreactelectrochemicallywiththeelectrodeswhentheLEDiselectrified,leadingtodeadlights,lightdecay,dark,blackeningandotherphenomena.Therefore,theidentificationofchipchemicalresiduesisveryimportantforLEDpackagingplants. Caseanalysis(1): Acustomerredlightbulbfounddarkproblem,buthasbeenunabletofindthereason,commissionedJinjiananalysisofthereasonsforfailure.Aftereliminatingthepackagingreasonsthroughaseriesofinstrumentalanalysis,Jinjianinspectedthebarecrystalsprovidedbythesupplier.Itwasfoundthattherewerecontaminantsindifferentareasineachchip'sluminousregion.EnergyspectrumanalysisshowedthatthecontaminantscontainedCandOelements,indicatingthatthecontaminantswereorganic.Werecommendthatcustomerspayattentiontotheassessmentofchipmanufacturers'productionprocessspecificationsandworkshopenvironment,andstrengthentheinspectionofchipincomingmaterials. Note:ManufacturingprocessofLEDchip Epitaxialfilmcleaningcoatingoftransparentelectrodelayercoatingoftransparentelectrodelayerphotolithographyoftransparentelectrodepatterncorrosionde-coatingde-gluephotolitlithoglitlitlithoglitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitGrinding_Cutting_Chip_FinishedProductTesting. Afterthegrowthoftheepitaxychip,thenextstepistomaketheelectrodesfortheLEDepitaxychip(Ppole,Npole),thencuttheLEDepitaxychipwithalaseroradiamondknife,makethechip,andthenextract
Analysis of Manufacturing Process and Testing Items of LED Chips
(Summary description)ChipisthemostcriticalrawmaterialofLED.ItsqualitydirectlydeterminestheperformanceofLED.Especiallyforhigh-endLEDusedinautomotiveorsolid-statelightingequipment,thereisabsolutelynodefect,thatistosay,thereliabilityofsuchequipmentmustbeveryhigh.However,duetothelackofexperienceandequipmentinchipincominginspection,LEDpackagingfactoriesusuallydonotcarryoutincominginspectiononchips.Afterpurchasingunqualifiedchips,theyoftensufferfromdumblosses.OnthebasisofaccumulatingalargenumberoffailureanalysiscasesofLED,JinjianInspectionintroducesthebusinessofincominginspectionofLEDchips,andidentifiestheadvantagesanddisadvantagesofthechipsbyusinghigh-endanalyticalinstruments.ThistestingservicecanbeusedasasupplementtotheincominginspectionofLEDpackagingplant/chipagentfactory,topreventbadchipsfrombeingstoredinstorage,andtoavoidtheoveralllossoflampbeadscausedbychipqualityproblems. Testingitems: I.TestingofPerformanceParametersofChips Wd(mainwavelength),Iv(brightness),Vf(forwardvoltage),Ir(leakage),ESD(antistaticability)andotherchipphotoelectricperformancetesting,Jinjianasathird-partytestingagencycanidentifywhethertheproductdataprovidedbysuppliersmeetthestandards. II.ChipDefectFinding Detectioncontent: 1.Chipsizemeasurement,chipsizeandelectrodesizemeettherequirements,whethertheelectrodepatterniscomplete. 2.Whetherthechiphasdefectssuchassolderjointcontamination,solderjointbreakage,grainbreakage,graincuttingsizedifference,graincuttinginclination,etc. ThedamageoftheLEDchipwilldirectlyleadtothefailureoftheLED,soitisveryimportanttoimprovethereliabilityoftheLEDchip.Thespringclampissometimesusedtofixthechipintheevaporationprocess,sotheclampmarkswillbeproduced.Inyellowlightoperation,ifthedevelopmentisincompleteandthereareholesinthehood,therewillberesidualmetalintheluminousregion.Inthepreviousstageofgrainproduction,tweezers,flowerbasketandcarriermustbeusedinallprocessessuchascleaning,evaporation,yellowlight,chemicaletching,fusionandgrinding,soscratchingofgrainelectrodeswilloccur. Theinfluenceofchipelectrodesonsolderjoints:theimproperevaporationofchipelectrodesleadstothelossordamageofelectrodesaftersolderingwires;thepoorsolderabilityofchipelectrodesleadstovirtualsolderingofsolderballs;improperstorageofchipleadstooxidationofelectrodesurface,surfacecontaminationandsoon.Theslightcontaminationofbondingsurfacemayaffectthemetaloriginbetweenthetwo.Subdiffusioncausesfailureorvirtualwelding. 3.DefectFindinginChipEpitaxyZone Intheprocessofhightemperaturecrystallization,impuritieswillbeintroducedintothesubstrate,sedimentresidueintheMOCVDreactionchamber,peripheralgasandMosource.Theseimpuritieswillpenetrateintotheepitaxylayer,preventthenucleationofGaNcrystal,formvariousepitaxydefects,andeventuallyformtinypitsonthesurfaceofepitaxylayer,whichwillseriouslyaffecttheepitaxy.Crystalqualityandpropertiesofextendedfilmmaterials.Jinjianhasdevelopedafastdetectionmethodtoidentifythedefectsofchipepitaxy.Itcandetect80%ofthedefectsofchipepitaxylayeratlowcostandquickly,andhelpLEDcustomerschoosehighqualityepitaxychipsandchips. 4.Observationofchiptechnologyandcleanliness ElectrodeprocessingisakeyprocessintheproductionofLEDchips,includingcleaning,evaporation,yellowlight,chemicaletching,fusion,grinding,willbeexposedtomanychemicalcleaningagents,ifthechipcleaningisnotcleanenough,willcauseharmfulchemicalresidues.TheseharmfulchemicalswillreactelectrochemicallywiththeelectrodeswhentheLEDiselectrified,leadingtodeadlights,lightdecay,dark,blackeningandotherphenomena.Therefore,theidentificationofchipchemicalresiduesisveryimportantforLEDpackagingplants. Caseanalysis(1): Acustomerredlightbulbfounddarkproblem,buthasbeenunabletofindthereason,commissionedJinjiananalysisofthereasonsforfailure.Aftereliminatingthepackagingreasonsthroughaseriesofinstrumentalanalysis,Jinjianinspectedthebarecrystalsprovidedbythesupplier.Itwasfoundthattherewerecontaminantsindifferentareasineachchip'sluminousregion.EnergyspectrumanalysisshowedthatthecontaminantscontainedCandOelements,indicatingthatthecontaminantswereorganic.Werecommendthatcustomerspayattentiontotheassessmentofchipmanufacturers'productionprocessspecificationsandworkshopenvironment,andstrengthentheinspectionofchipincomingmaterials. Note:ManufacturingprocessofLEDchip Epitaxialfilmcleaningcoatingoftransparentelectrodelayercoatingoftransparentelectrodelayerphotolithographyoftransparentelectrodepatterncorrosionde-coatingde-gluephotolitlithoglitlitlithoglitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitGrinding_Cutting_Chip_FinishedProductTesting. Afterthegrowthoftheepitaxychip,thenextstepistomaketheelectrodesfortheLEDepitaxychip(Ppole,Npole),thencuttheLEDepitaxychipwithalaseroradiamondknife,makethechip,andthenextract
- Categories:Industry News
- Author:
- Origin:
- Time of issue:2019-07-16 08:41
- Views:
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通用底部
-
About us
- Company profile Honor Plant
-
Products
- SMD LED Digital tube Triode ......
-
Talent
- Idea Recruitment
Service hotline

Copyright © Dongguan Taiming Photoelectric Technology Co., Ltd. All Rights Reserved. 粤ICP备15044056号-2
