tm
hx

NEWS CENTER

新闻资讯

>
>
Manufacturing process of LED lamp beads - table inscription
Check category

Manufacturing process of LED lamp beads - table inscription

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2019-07-16 08:47
  • Views:

(Summary description)I.ProductionprocessofLEDlampbeads 1.Production: A)Cleaning:PCBorLEDbracketiscleanedbyultrasonicwaveanddried.   B)Mounting:AfterthebottomelectrodeofLEDtubecore(largewafer)isequippedwithsilverglue,theexpandedtubecore(largewafer)isplacedonthespinningtable.Underthemicroscope,thetubecoreismountedonebyoneonthecorrespondingpadofPCBorLEDbracket,andthensinteredtosolidifythesilverglue.   C)Pressurewelding:TheelectrodesareconnectedtothecoreoftheLEDtubewithanaluminiumwireoragoldwireweldertoactasaleadforcurrentinjection.LEDisdirectlyinstalledonPCB,generallyusingaluminiumwireweldingmachine.(GoldwirewelderisrequiredforwhiteTOP-LEDproduction)   D)Packaging:LEDcoreandweldingwireareprotectedbydispensingandepoxy.TherearestrictrequirementsfortheshapeofthecuredcolloidwhendispensingglueonPCBboard,whichisdirectlyrelatedtothebrightnessofbacklightproducts.Thisprocesswillalsoundertakethetaskofpointphosphor(whiteLED).   E)Welding:IfthebacklightisSMD-LEDorotherencapsulatedLED,theLEDneedstobeweldedtothePCBboardbeforetheassemblyprocess.   F)Filmcutting:variousdiffusionfilmsandreflectivefilmsneededforcuttingbacklightsourcewithpunchdie.   G)Assembly:Accordingtotherequirementsofthedrawings,thebacklightmaterialsaremanuallyinstalledinthecorrectposition.   H)Testing:Checkthephotoelectricparametersofbacklightandtheuniformityoflightoutput.   2.Packaging:Packingandwarehousingfinishedproductsasrequired.   II.PackagingTechnology   1.TasksofLEDpackaging ItconnectstheexternalleadstotheelectrodesoftheLEDchip,protectstheLEDchipandimprovestheefficiencyoflightextraction.Thekeyprocessesaremounting,pressureweldingandpackaging.   2.LEDPackagingForm LEDpackagingcanbesaidtobeavarietyofforms,mainlyaccordingtodifferentapplicationoccasionstousethecorrespondingsize,heatdissipationcountermeasuresandlightingeffect.LedsareclassifiedasLamp-LED,TOP-LED,Side-LED,SMD-LED,High-Power-LEDandsoon.   3.LEDpackagingprocess   A)ChipInspection Microscopicexamination:Whetherthematerialsurfaceismechanicallydamaged,whetherthesizeoflockhillchipandthesizeofelectrodemeetthetechnologicalrequirements,andwhetherthepatternofelectrodeiscomplete.   B)Expansion BecauseLEDchipsarestillarrangedtightlyafterscratching(about0.1mm),itisnotconducivetotheoperationofthelaterprocess.Weuseexpandertoexpandthefilmofthebondingchip.ThedistancebetweentheLEDchipsisstretchedtoabout0.6mm.Manualexpansioncanalsobeused,butitiseasytocausebadproblemssuchaschipdroppingandwaste.   C)dispensing SilverglueorinsulatingglueatthecorrespondingpositionofLEDbracket.(ForGaAsandSiCconductivesubstrates,red,yellowandyellow-greenchipswithbackelectrodesaremadewithsilverglue.ForblueandgreenLEDchipsonsapphireinsulatedsubstrates,insulatingglueisusedtofixthechips.)Thetechnicaldifficultyliesinthecontrolofdispensingquantity,andtherearedetailedtechnicalrequirementsincolloidheightanddispensingposition.Assilverglueandinsulatinggluehavestrictrequirementsinstorageanduse,thewake-up,stirringandusetimeofsilverglueareallmattersneedingattentionintechnology.   D)Incontrasttodispensing,thegluepreparationmachinefirstcoatsthesilverglueonthebackelectrodeoftheled,andtheninstallstheLEDwithsilverglueonthebackbracket.Theefficiencyofgluepreparationismuchhigherthanthatofdispensing,butnotallproductsaresuitableforgluepreparationprocess.   E)TheexpandedLEDchip(glueornon-glue)isplacedonthefixtureofthepiercingtablebyhand.TheLEDbracketisplacedunderthefixture.Underthemicroscope,theLEDchipisprickedonebyonetothecorrespondingpositionwithaneedle.Comparingwithautomaticmounting,manualspinninghasoneadvantage.Itisconvenienttoreplacedifferentchipsatanytime.Itissuitableforproductsthatneedtoinstallmultiplechips.   F)Automaticmounting Infact,automaticmountingcombinestwostepsofgluedipping(dispensing)andchipinstallation.First,silverglue(insulatingglue)isappliedontheLEDbracket,thentheLEDchipissuckedupandmovedbyvacuumsuctionnozzle,andthenplacedonthecorrespondingbracketposition.Intheprocessofautomaticmounting,weshouldbefamiliarwithequipmentoperationprogramming,andadjustthegluestainingandinstallationaccuracyoftheequipment.BakelitesuctionnozzlesshouldbeselectedasfaraspossibleintheselectionofsuctionnozzlestopreventdamagetothesurfaceofLEDchips,especiallyforblueandgreenchips.Becausethenozzlewillscratchthecurrentdiffusionlayeronthechipsurface.   G)Sintering Thepurposeofsinteringistosolidifysilverglue.Sinteringrequirestemperaturemonitoringtopreventbadbatchperformance.Thesinteringtemperatureofsilverglueisgenerallycontrolledat150Candthesinteringtimeis2hours.Accordingtotheactualsituation,itcanbeadjustedto170Cfor1hour.Insulationglueisgenerally150C,1hour.Silvergluesinteringovenmustbeopenedandreplacedatintervalsof2hours(or1hour)accordingtothetechnologicalrequirements,andshouldnotbeopenedatwill.Sinteringovenshouldnotbeusedforotherpurposestopreventpollution.   H)PressureWelding ThepurposeofpressureweldingistoleadtheelectrodestotheLEDchipandcompletetheconnectionbetweentheinternalandexternalleadsoftheproduct. TherearetwokindsofpressureweldingprocessesforLED:goldwireballweldingandaluminiumwirewel

Manufacturing process of LED lamp beads - table inscription

(Summary description)I.ProductionprocessofLEDlampbeads 1.Production: A)Cleaning:PCBorLEDbracketiscleanedbyultrasonicwaveanddried.   B)Mounting:AfterthebottomelectrodeofLEDtubecore(largewafer)isequippedwithsilverglue,theexpandedtubecore(largewafer)isplacedonthespinningtable.Underthemicroscope,thetubecoreismountedonebyoneonthecorrespondingpadofPCBorLEDbracket,andthensinteredtosolidifythesilverglue.   C)Pressurewelding:TheelectrodesareconnectedtothecoreoftheLEDtubewithanaluminiumwireoragoldwireweldertoactasaleadforcurrentinjection.LEDisdirectlyinstalledonPCB,generallyusingaluminiumwireweldingmachine.(GoldwirewelderisrequiredforwhiteTOP-LEDproduction)   D)Packaging:LEDcoreandweldingwireareprotectedbydispensingandepoxy.TherearestrictrequirementsfortheshapeofthecuredcolloidwhendispensingglueonPCBboard,whichisdirectlyrelatedtothebrightnessofbacklightproducts.Thisprocesswillalsoundertakethetaskofpointphosphor(whiteLED).   E)Welding:IfthebacklightisSMD-LEDorotherencapsulatedLED,theLEDneedstobeweldedtothePCBboardbeforetheassemblyprocess.   F)Filmcutting:variousdiffusionfilmsandreflectivefilmsneededforcuttingbacklightsourcewithpunchdie.   G)Assembly:Accordingtotherequirementsofthedrawings,thebacklightmaterialsaremanuallyinstalledinthecorrectposition.   H)Testing:Checkthephotoelectricparametersofbacklightandtheuniformityoflightoutput.   2.Packaging:Packingandwarehousingfinishedproductsasrequired.   II.PackagingTechnology   1.TasksofLEDpackaging ItconnectstheexternalleadstotheelectrodesoftheLEDchip,protectstheLEDchipandimprovestheefficiencyoflightextraction.Thekeyprocessesaremounting,pressureweldingandpackaging.   2.LEDPackagingForm LEDpackagingcanbesaidtobeavarietyofforms,mainlyaccordingtodifferentapplicationoccasionstousethecorrespondingsize,heatdissipationcountermeasuresandlightingeffect.LedsareclassifiedasLamp-LED,TOP-LED,Side-LED,SMD-LED,High-Power-LEDandsoon.   3.LEDpackagingprocess   A)ChipInspection Microscopicexamination:Whetherthematerialsurfaceismechanicallydamaged,whetherthesizeoflockhillchipandthesizeofelectrodemeetthetechnologicalrequirements,andwhetherthepatternofelectrodeiscomplete.   B)Expansion BecauseLEDchipsarestillarrangedtightlyafterscratching(about0.1mm),itisnotconducivetotheoperationofthelaterprocess.Weuseexpandertoexpandthefilmofthebondingchip.ThedistancebetweentheLEDchipsisstretchedtoabout0.6mm.Manualexpansioncanalsobeused,butitiseasytocausebadproblemssuchaschipdroppingandwaste.   C)dispensing SilverglueorinsulatingglueatthecorrespondingpositionofLEDbracket.(ForGaAsandSiCconductivesubstrates,red,yellowandyellow-greenchipswithbackelectrodesaremadewithsilverglue.ForblueandgreenLEDchipsonsapphireinsulatedsubstrates,insulatingglueisusedtofixthechips.)Thetechnicaldifficultyliesinthecontrolofdispensingquantity,andtherearedetailedtechnicalrequirementsincolloidheightanddispensingposition.Assilverglueandinsulatinggluehavestrictrequirementsinstorageanduse,thewake-up,stirringandusetimeofsilverglueareallmattersneedingattentionintechnology.   D)Incontrasttodispensing,thegluepreparationmachinefirstcoatsthesilverglueonthebackelectrodeoftheled,andtheninstallstheLEDwithsilverglueonthebackbracket.Theefficiencyofgluepreparationismuchhigherthanthatofdispensing,butnotallproductsaresuitableforgluepreparationprocess.   E)TheexpandedLEDchip(glueornon-glue)isplacedonthefixtureofthepiercingtablebyhand.TheLEDbracketisplacedunderthefixture.Underthemicroscope,theLEDchipisprickedonebyonetothecorrespondingpositionwithaneedle.Comparingwithautomaticmounting,manualspinninghasoneadvantage.Itisconvenienttoreplacedifferentchipsatanytime.Itissuitableforproductsthatneedtoinstallmultiplechips.   F)Automaticmounting Infact,automaticmountingcombinestwostepsofgluedipping(dispensing)andchipinstallation.First,silverglue(insulatingglue)isappliedontheLEDbracket,thentheLEDchipissuckedupandmovedbyvacuumsuctionnozzle,andthenplacedonthecorrespondingbracketposition.Intheprocessofautomaticmounting,weshouldbefamiliarwithequipmentoperationprogramming,andadjustthegluestainingandinstallationaccuracyoftheequipment.BakelitesuctionnozzlesshouldbeselectedasfaraspossibleintheselectionofsuctionnozzlestopreventdamagetothesurfaceofLEDchips,especiallyforblueandgreenchips.Becausethenozzlewillscratchthecurrentdiffusionlayeronthechipsurface.   G)Sintering Thepurposeofsinteringistosolidifysilverglue.Sinteringrequirestemperaturemonitoringtopreventbadbatchperformance.Thesinteringtemperatureofsilverglueisgenerallycontrolledat150Candthesinteringtimeis2hours.Accordingtotheactualsituation,itcanbeadjustedto170Cfor1hour.Insulationglueisgenerally150C,1hour.Silvergluesinteringovenmustbeopenedandreplacedatintervalsof2hours(or1hour)accordingtothetechnologicalrequirements,andshouldnotbeopenedatwill.Sinteringovenshouldnotbeusedforotherpurposestopreventpollution.   H)PressureWelding ThepurposeofpressureweldingistoleadtheelectrodestotheLEDchipandcompletetheconnectionbetweentheinternalandexternalleadsoftheproduct. TherearetwokindsofpressureweldingprocessesforLED:goldwireballweldingandaluminiumwirewel

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2019-07-16 08:47
  • Views:
Information
I. Production process of LED lamp beads
 
1. Production:
 
A) Cleaning: PCB or LED bracket is cleaned by ultrasonic wave and dried.
 
 
 
B) Mounting: After the bottom electrode of LED tube core (large wafer) is equipped with silver glue, the expanded tube core (large wafer) is placed on the spinning table. Under the microscope, the tube core is mounted one by one on the corresponding pad of PCB or LED bracket, and then sintered to solidify the silver glue.
 
 
 
C) Pressure welding: The electrodes are connected to the core of the LED tube with an aluminium wire or a gold wire welder to act as a lead for current injection. LED is directly installed on PCB, generally using aluminium wire welding machine. (Gold wire welder is required for white TOP-LED production)
 
 
 
D) Packaging: LED core and welding wire are protected by dispensing and epoxy. There are strict requirements for the shape of the cured colloid when dispensing glue on PCB board, which is directly related to the brightness of backlight products. This process will also undertake the task of point phosphor (white LED).
 
 
 
E) Welding: If the backlight is SMD-LED or other encapsulated LED, the LED needs to be welded to the PCB board before the assembly process.
 
 
 
F) Film cutting: various diffusion films and reflective films needed for cutting back light source with punch die.
 
 
 
G) Assembly: According to the requirements of the drawings, the backlight materials are manually installed in the correct position.
 
 
 
H) Testing: Check the photoelectric parameters of backlight and the uniformity of light output.
 
 
 
2. Packaging: Packing and warehousing finished products as required.
 
 
 
II. Packaging Technology
 
 
 
1. Tasks of LED packaging
 
It connects the external leads to the electrodes of the LED chip, protects the LED chip and improves the efficiency of light extraction. The key processes are mounting, pressure welding and packaging.
 
 
 
2. LED Packaging Form
 
LED packaging can be said to be a variety of forms, mainly according to different application occasions to use the corresponding size, heat dissipation countermeasures and lighting effect. Leds are classified as Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED and so on.
 
 
 
3. LED packaging process
 
 
 
A) Chip Inspection
 
Microscopic examination: Whether the material surface is mechanically damaged, whether the size of lockhill chip and the size of electrode meet the technological requirements, and whether the pattern of electrode is complete.
 
 
 
B) Expansion
 
Because LED chips are still arranged tightly after scratching (about 0.1mm), it is not conducive to the operation of the later process. We use expander to expand the film of the bonding chip. The distance between the LED chips is stretched to about 0.6 mm. Manual expansion can also be used, but it is easy to cause bad problems such as chip dropping and waste.
 
 
 
C) dispensing
 
Silver glue or insulating glue at the corresponding position of LED bracket. (For GaAs and SiC conductive substrates, red, yellow and yellow-green chips with back electrodes are made with silver glue. For blue and green LED chips on sapphire insulated substrates, insulating glue is used to fix the chips. ) The technical difficulty lies in the control of dispensing quantity, and there are detailed technical requirements in colloid height and dispensing position. As silver glue and insulating glue have strict requirements in storage and use, the wake-up, stirring and use time of silver glue are all matters needing attention in technology.
 
 
 
D) In contrast to dispensing, the glue preparation machine first coats the silver glue on the back electrode of the led, and then installs the LED with silver glue on the back bracket. The efficiency of glue preparation is much higher than that of dispensing, but not all products are suitable for glue preparation process.
 
 
 
E) The expanded LED chip (glue or non-glue) is placed on the fixture of the piercing table by hand. The LED bracket is placed under the fixture. Under the microscope, the LED chip is pricked one by one to the corresponding position with a needle. Comparing with automatic mounting, manual spinning has one advantage. It is convenient to replace different chips at any time. It is suitable for products that need to install multiple chips.
 
 
 
F) Automatic mounting
 
In fact, automatic mounting combines two steps of glue dipping (dispensing) and chip installation. First, silver glue (insulating glue) is applied on the LED bracket, then the LED chip is sucked up and moved by vacuum suction nozzle, and then placed on the corresponding bracket position. In the process of automatic mounting, we should be familiar with equipment operation programming, and adjust the glue staining and installation accuracy of the equipment. Bakelite suction nozzles should be selected as far as possible in the selection of suction nozzles to prevent damage to the surface of LED chips, especially for blue and green chips. Because the nozzle will scratch the current diffusion layer on the chip surface.
 
 
 
G) Sintering
 
The purpose of sintering is to solidify silver glue. Sintering requires temperature monitoring to prevent bad batch performance. The sintering temperature of silver glue is generally controlled at 150 C and the sintering time is 2 hours. According to the actual situation, it can be adjusted to 170 C for 1 hour. Insulation glue is generally 150 C, 1 hour. Silver glue sintering oven must be opened and replaced at intervals of 2 hours (or 1 hour) according to the technological requirements, and should not be opened at will. Sintering oven should not be used for other purposes to prevent pollution.
 
 
 
H) Pressure Welding
 
The purpose of pressure welding is to lead the electrodes to the LED chip and complete the connection between the internal and external leads of the product.
 
There are two kinds of pressure welding processes for LED: gold wire ball welding and aluminium wire welding. The right picture is the process of aluminium wire bonding. First, the first point is pressed on the electrode of the LED chip, then the aluminium wire is pulled over the corresponding bracket, then the second point is pressed and the aluminium wire is broken. The process of gold wire ball welding is similar to that of burning a ball before pressing the first point. Pressure welding is the key link in the LED packaging technology. The shape of arc wire, solder joint and tension of pressure welding gold wire (aluminum wire) need to be monitored. In-depth study of pressure welding process involves many problems, such as material of gold (aluminium) wire, ultrasonic power, pressure of pressure welding, selection of splitting tool (steel nozzle), splitting tool.(

Scan the QR code to read on your phone

通用底部

Time of issue:2019-05-17 00:00:00

Service hotline

0769-87285383

Welcome your consultation!

Messages

xh

Copyright © Dongguan Taiming Photoelectric Technology Co., Ltd. All Rights Reserved. 粤ICP备15044056号-2

通用底部

Time of issue:2019-05-17 00:00:00

Service hotline

0769-87285383

Welcome your consultation!

Messages

xh

Copyright © Dongguan Taiming Photoelectric Technology Co., Ltd. All Rights Reserved. 粤ICP备15044056号-2

tm