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Manufacturing process of LED lamp beads - table inscription
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- Time of issue:2019-07-16 08:47
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(Summary description)I.ProductionprocessofLEDlampbeads 1.Production: A)Cleaning:PCBorLEDbracketiscleanedbyultrasonicwaveanddried. B)Mounting:AfterthebottomelectrodeofLEDtubecore(largewafer)isequippedwithsilverglue,theexpandedtubecore(largewafer)isplacedonthespinningtable.Underthemicroscope,thetubecoreismountedonebyoneonthecorrespondingpadofPCBorLEDbracket,andthensinteredtosolidifythesilverglue. C)Pressurewelding:TheelectrodesareconnectedtothecoreoftheLEDtubewithanaluminiumwireoragoldwireweldertoactasaleadforcurrentinjection.LEDisdirectlyinstalledonPCB,generallyusingaluminiumwireweldingmachine.(GoldwirewelderisrequiredforwhiteTOP-LEDproduction) D)Packaging:LEDcoreandweldingwireareprotectedbydispensingandepoxy.TherearestrictrequirementsfortheshapeofthecuredcolloidwhendispensingglueonPCBboard,whichisdirectlyrelatedtothebrightnessofbacklightproducts.Thisprocesswillalsoundertakethetaskofpointphosphor(whiteLED). E)Welding:IfthebacklightisSMD-LEDorotherencapsulatedLED,theLEDneedstobeweldedtothePCBboardbeforetheassemblyprocess. F)Filmcutting:variousdiffusionfilmsandreflectivefilmsneededforcuttingbacklightsourcewithpunchdie. G)Assembly:Accordingtotherequirementsofthedrawings,thebacklightmaterialsaremanuallyinstalledinthecorrectposition. H)Testing:Checkthephotoelectricparametersofbacklightandtheuniformityoflightoutput. 2.Packaging:Packingandwarehousingfinishedproductsasrequired. II.PackagingTechnology 1.TasksofLEDpackaging ItconnectstheexternalleadstotheelectrodesoftheLEDchip,protectstheLEDchipandimprovestheefficiencyoflightextraction.Thekeyprocessesaremounting,pressureweldingandpackaging. 2.LEDPackagingForm LEDpackagingcanbesaidtobeavarietyofforms,mainlyaccordingtodifferentapplicationoccasionstousethecorrespondingsize,heatdissipationcountermeasuresandlightingeffect.LedsareclassifiedasLamp-LED,TOP-LED,Side-LED,SMD-LED,High-Power-LEDandsoon. 3.LEDpackagingprocess A)ChipInspection Microscopicexamination:Whetherthematerialsurfaceismechanicallydamaged,whetherthesizeoflockhillchipandthesizeofelectrodemeetthetechnologicalrequirements,andwhetherthepatternofelectrodeiscomplete. B)Expansion BecauseLEDchipsarestillarrangedtightlyafterscratching(about0.1mm),itisnotconducivetotheoperationofthelaterprocess.Weuseexpandertoexpandthefilmofthebondingchip.ThedistancebetweentheLEDchipsisstretchedtoabout0.6mm.Manualexpansioncanalsobeused,butitiseasytocausebadproblemssuchaschipdroppingandwaste. C)dispensing SilverglueorinsulatingglueatthecorrespondingpositionofLEDbracket.(ForGaAsandSiCconductivesubstrates,red,yellowandyellow-greenchipswithbackelectrodesaremadewithsilverglue.ForblueandgreenLEDchipsonsapphireinsulatedsubstrates,insulatingglueisusedtofixthechips.)Thetechnicaldifficultyliesinthecontrolofdispensingquantity,andtherearedetailedtechnicalrequirementsincolloidheightanddispensingposition.Assilverglueandinsulatinggluehavestrictrequirementsinstorageanduse,thewake-up,stirringandusetimeofsilverglueareallmattersneedingattentionintechnology. D)Incontrasttodispensing,thegluepreparationmachinefirstcoatsthesilverglueonthebackelectrodeoftheled,andtheninstallstheLEDwithsilverglueonthebackbracket.Theefficiencyofgluepreparationismuchhigherthanthatofdispensing,butnotallproductsaresuitableforgluepreparationprocess. E)TheexpandedLEDchip(glueornon-glue)isplacedonthefixtureofthepiercingtablebyhand.TheLEDbracketisplacedunderthefixture.Underthemicroscope,theLEDchipisprickedonebyonetothecorrespondingpositionwithaneedle.Comparingwithautomaticmounting,manualspinninghasoneadvantage.Itisconvenienttoreplacedifferentchipsatanytime.Itissuitableforproductsthatneedtoinstallmultiplechips. F)Automaticmounting Infact,automaticmountingcombinestwostepsofgluedipping(dispensing)andchipinstallation.First,silverglue(insulatingglue)isappliedontheLEDbracket,thentheLEDchipissuckedupandmovedbyvacuumsuctionnozzle,andthenplacedonthecorrespondingbracketposition.Intheprocessofautomaticmounting,weshouldbefamiliarwithequipmentoperationprogramming,andadjustthegluestainingandinstallationaccuracyoftheequipment.BakelitesuctionnozzlesshouldbeselectedasfaraspossibleintheselectionofsuctionnozzlestopreventdamagetothesurfaceofLEDchips,especiallyforblueandgreenchips.Becausethenozzlewillscratchthecurrentdiffusionlayeronthechipsurface. G)Sintering Thepurposeofsinteringistosolidifysilverglue.Sinteringrequirestemperaturemonitoringtopreventbadbatchperformance.Thesinteringtemperatureofsilverglueisgenerallycontrolledat150Candthesinteringtimeis2hours.Accordingtotheactualsituation,itcanbeadjustedto170Cfor1hour.Insulationglueisgenerally150C,1hour.Silvergluesinteringovenmustbeopenedandreplacedatintervalsof2hours(or1hour)accordingtothetechnologicalrequirements,andshouldnotbeopenedatwill.Sinteringovenshouldnotbeusedforotherpurposestopreventpollution. H)PressureWelding ThepurposeofpressureweldingistoleadtheelectrodestotheLEDchipandcompletetheconnectionbetweentheinternalandexternalleadsoftheproduct. TherearetwokindsofpressureweldingprocessesforLED:goldwireballweldingandaluminiumwirewel
Manufacturing process of LED lamp beads - table inscription
(Summary description)I.ProductionprocessofLEDlampbeads 1.Production: A)Cleaning:PCBorLEDbracketiscleanedbyultrasonicwaveanddried. B)Mounting:AfterthebottomelectrodeofLEDtubecore(largewafer)isequippedwithsilverglue,theexpandedtubecore(largewafer)isplacedonthespinningtable.Underthemicroscope,thetubecoreismountedonebyoneonthecorrespondingpadofPCBorLEDbracket,andthensinteredtosolidifythesilverglue. C)Pressurewelding:TheelectrodesareconnectedtothecoreoftheLEDtubewithanaluminiumwireoragoldwireweldertoactasaleadforcurrentinjection.LEDisdirectlyinstalledonPCB,generallyusingaluminiumwireweldingmachine.(GoldwirewelderisrequiredforwhiteTOP-LEDproduction) D)Packaging:LEDcoreandweldingwireareprotectedbydispensingandepoxy.TherearestrictrequirementsfortheshapeofthecuredcolloidwhendispensingglueonPCBboard,whichisdirectlyrelatedtothebrightnessofbacklightproducts.Thisprocesswillalsoundertakethetaskofpointphosphor(whiteLED). E)Welding:IfthebacklightisSMD-LEDorotherencapsulatedLED,theLEDneedstobeweldedtothePCBboardbeforetheassemblyprocess. F)Filmcutting:variousdiffusionfilmsandreflectivefilmsneededforcuttingbacklightsourcewithpunchdie. G)Assembly:Accordingtotherequirementsofthedrawings,thebacklightmaterialsaremanuallyinstalledinthecorrectposition. H)Testing:Checkthephotoelectricparametersofbacklightandtheuniformityoflightoutput. 2.Packaging:Packingandwarehousingfinishedproductsasrequired. II.PackagingTechnology 1.TasksofLEDpackaging ItconnectstheexternalleadstotheelectrodesoftheLEDchip,protectstheLEDchipandimprovestheefficiencyoflightextraction.Thekeyprocessesaremounting,pressureweldingandpackaging. 2.LEDPackagingForm LEDpackagingcanbesaidtobeavarietyofforms,mainlyaccordingtodifferentapplicationoccasionstousethecorrespondingsize,heatdissipationcountermeasuresandlightingeffect.LedsareclassifiedasLamp-LED,TOP-LED,Side-LED,SMD-LED,High-Power-LEDandsoon. 3.LEDpackagingprocess A)ChipInspection Microscopicexamination:Whetherthematerialsurfaceismechanicallydamaged,whetherthesizeoflockhillchipandthesizeofelectrodemeetthetechnologicalrequirements,andwhetherthepatternofelectrodeiscomplete. B)Expansion BecauseLEDchipsarestillarrangedtightlyafterscratching(about0.1mm),itisnotconducivetotheoperationofthelaterprocess.Weuseexpandertoexpandthefilmofthebondingchip.ThedistancebetweentheLEDchipsisstretchedtoabout0.6mm.Manualexpansioncanalsobeused,butitiseasytocausebadproblemssuchaschipdroppingandwaste. C)dispensing SilverglueorinsulatingglueatthecorrespondingpositionofLEDbracket.(ForGaAsandSiCconductivesubstrates,red,yellowandyellow-greenchipswithbackelectrodesaremadewithsilverglue.ForblueandgreenLEDchipsonsapphireinsulatedsubstrates,insulatingglueisusedtofixthechips.)Thetechnicaldifficultyliesinthecontrolofdispensingquantity,andtherearedetailedtechnicalrequirementsincolloidheightanddispensingposition.Assilverglueandinsulatinggluehavestrictrequirementsinstorageanduse,thewake-up,stirringandusetimeofsilverglueareallmattersneedingattentionintechnology. D)Incontrasttodispensing,thegluepreparationmachinefirstcoatsthesilverglueonthebackelectrodeoftheled,andtheninstallstheLEDwithsilverglueonthebackbracket.Theefficiencyofgluepreparationismuchhigherthanthatofdispensing,butnotallproductsaresuitableforgluepreparationprocess. E)TheexpandedLEDchip(glueornon-glue)isplacedonthefixtureofthepiercingtablebyhand.TheLEDbracketisplacedunderthefixture.Underthemicroscope,theLEDchipisprickedonebyonetothecorrespondingpositionwithaneedle.Comparingwithautomaticmounting,manualspinninghasoneadvantage.Itisconvenienttoreplacedifferentchipsatanytime.Itissuitableforproductsthatneedtoinstallmultiplechips. F)Automaticmounting Infact,automaticmountingcombinestwostepsofgluedipping(dispensing)andchipinstallation.First,silverglue(insulatingglue)isappliedontheLEDbracket,thentheLEDchipissuckedupandmovedbyvacuumsuctionnozzle,andthenplacedonthecorrespondingbracketposition.Intheprocessofautomaticmounting,weshouldbefamiliarwithequipmentoperationprogramming,andadjustthegluestainingandinstallationaccuracyoftheequipment.BakelitesuctionnozzlesshouldbeselectedasfaraspossibleintheselectionofsuctionnozzlestopreventdamagetothesurfaceofLEDchips,especiallyforblueandgreenchips.Becausethenozzlewillscratchthecurrentdiffusionlayeronthechipsurface. G)Sintering Thepurposeofsinteringistosolidifysilverglue.Sinteringrequirestemperaturemonitoringtopreventbadbatchperformance.Thesinteringtemperatureofsilverglueisgenerallycontrolledat150Candthesinteringtimeis2hours.Accordingtotheactualsituation,itcanbeadjustedto170Cfor1hour.Insulationglueisgenerally150C,1hour.Silvergluesinteringovenmustbeopenedandreplacedatintervalsof2hours(or1hour)accordingtothetechnologicalrequirements,andshouldnotbeopenedatwill.Sinteringovenshouldnotbeusedforotherpurposestopreventpollution. H)PressureWelding ThepurposeofpressureweldingistoleadtheelectrodestotheLEDchipandcompletetheconnectionbetweentheinternalandexternalleadsoftheproduct. TherearetwokindsofpressureweldingprocessesforLED:goldwireballweldingandaluminiumwirewel
- Categories:Industry News
- Author:
- Origin:
- Time of issue:2019-07-16 08:47
- Views:
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通用底部
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About us
- Company profile Honor Plant
-
Products
- SMD LED Digital tube Triode ......
-
Talent
- Idea Recruitment
Service hotline

Copyright © Dongguan Taiming Photoelectric Technology Co., Ltd. All Rights Reserved. 粤ICP备15044056号-2
