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Reasons for Dead Lamp in LED Bead Welding Process

Reasons for Dead Lamp in LED Bead Welding Process

Intheprocessofproduction,wealwaysencounterthephenomenonthatone,oneorseveralbeadscan'tbelightedwhenwetestsomebeadsafterstickingtheboard.Inviewofthisphenomenon,thispapermakesasummary:     Deadlampinweldingprocess     1.Commonweldingmethodscanbedividedintoelectricsoldering,heatingplatformweldingandreflowwelding.     A,solderingironweldingisthemostcommon,suchassamplemaking,maintenance,becausemostoftheexistingmanufacturersinordertosavecosts,thepurchaseofsolderingironismostlyslightlyunqualifiedproducts,mostlygroundedbadly,thereisleakage.Intheprocessofwelding,thisisequivalenttotheleakageofsolderingirontip-weldedLED-humanbody-earthformaloop.Thatistosay,itistensoftimes-hundredsoftimesthevoltagethatthebulbbears,whichisaddedtothetopoftheLEDbulb,andburnsitoutinstantaneously.Note:Thesituationofelectrostatictapeconnectionwillbemoreserious,becausewhenthebodyisconnectedwiththeelectrostatictape,theresistancetoformacircuittothegroundwillbesmaller,andthecurrentfromthebodytothelampbeadswillbelarger.Thisisalsotheproblemthatmanypeoplesaythattherearestillsomanylampbeadsdamagedwithelectrostatictape.     B.Deadlampcausedbyweldingofheatingplatform.Becauseofthecontinuoussamplelistoflampsandlanterns,mostenterprisesinordertomeettheneedsofsmallbatchesandsamplelist.Becauseoftheadvantagesoflowcostofequipment,simplestructureandoperation,heatingplatformhasbecomethebestproductiontool.However,duetotheuseenvironment(e.g.localtemperaturestoragewithfans).Intheunsteadyproblem)andthecontrolofweldingoperator'sproficiencyandweldingspeedhavebecomethemajorproblemofdeadlight.Inaddition,thereisthegroundingofheatingplatformequipment.     C.Reflowweldingisgenerallythemostreliablemodeofproduction,suitableformassproductionandprocessing.Ifimproperoperation,itwillcausemoreseriousdeadlightconsequences,suchasunreasonabletemperatureadjustment,poormachinegroundingandsoon.     2.Improperstoragecausesdeadlights:     Thiskindofproblemisthemostcommon.Becauseofthelackofattentiontomoisture-proofafterunpacking,thesealingglueoflampbeadsismostlymadeofsilicagel,whichhascertainwaterabsorptioncharacteristics.Afterdamplampbeadsstickingboard,silicagelwillexpandandshrinkafterhightemperatureweldingprocess.Thedeformationofgoldwire,chipandbracketwillcausethegoldwiretomoveandbreak.ItissuggestedthattheLEDshouldbestoredinadryandventilatedenvironmentwithastoragetemperatureof-40-+100Candarelativehumidityoflessthan85%.TheLEDshouldbeusedwithinthreemonthsofitsoriginalpackagingconditiontoavoidtherustofthebracket.WhenthepackagingbagoftheLEDisopened,itshouldbeusedassoonaspossibleandthestoragetemperatureshouldbekeptatthistime.Therelativehumidityisbelow60%at5-30C.     3.Chemicalcleaning:     DonotuseunknownchemicalliquidtocleantheLED,becauseitmaydamagethesurfaceoftheLEDcolloidandevencausecolloidcracks.Ifnecessary,cleantheLEDwithalcoholcottonswabundernormaltemperatureandventilationenvironment.Thebesttimeiscontrolledinoneminuteofwind.     4.Deformationcausesdeadlight:     Becausepartofthelampboardisdeformed,theoperatorwillgotoshaping.Becausetheplateisdeformed,theabovelampbeadsarealsodeformedtogether,breakingthegoldwireandcausingthelampnottoturnon.Itissuggestedthattheplatewiththistypeshouldbeshapingbeforeproduction.Thelongeronehasbeenassembledandmovedinproductionandmayalsocausedeformationandbreakageofgoldwires.Thereisalsostacking,theproductionprocessforconvenience,thelampboardwillbestackedatwill,becauseofgravity,thelowerlampbeadswillbedeformedbyforce,damagethegoldwire.     5.Heatdissipationstructure,powersupplyandlampboarddonotmatch:     Duetotheunreasonabledesignorselectionofpowersupply,thepowersupplyexceedsthemaximumlimitthatLEDcanwithstand(supercurrent,instantaneousimpact);irrationalheatdissipationstructureoflampswillcausedeadlightandprematurelightfailure.     6.PlantGrounding:     Itisnecessarytocheckwhetherthefactory'sgroundingwireisgoodornot.     7.Electrostatic:     StaticelectricitycancausethefailureofLEDfunction.ItissuggestedtopreventESDfromdamagingtheLED.     A.Operatorsmustwearanti-statichandringsandgloveswhentestingandassemblingLED.     B.Weldingequipmentandtestingequipment,workingtable,storagerack,etc.mustbewellgrounded.     C.UseionblowertoeliminatestaticelectricitycausedbyfrictionduringstorageandassemblyofLED.     D.Anti-staticcartridgeisusedforLEDcartridgeandelectrostaticbagisusedforpackaging.     E.Don'tbefluky,justtouchtheLED.     TheabnormalphenomenaofLEDdamagedbyESDareasfollows:     A.Reverseleakage,lightwillcauseadecreaseinbrightness,seriouslightsdonotturnon.     B.Theforwardvoltagedecreases.LEDcannotemitlightwhendrivenbylowcurrent.     24-hourhotline:15999793358(Weixinsamenumber)QQ:1780018226     Tel:0769-87285383-804     Fax:0769-87285383     Mailbox:ycw@taimingled.com     Address:No.9TengdaRoad,TengdaIndustrialPark,ZhangmuTown,DongguanCity,GuangdongProvince
Characteristics and Advantages of LED Plant Lamp Lighting

Characteristics and Advantages of LED Plant Lamp Lighting

CharacteristicsofLEDplantlamp:     1.Theeffectsofdifferentwavelengthsoflightonplantphotosynthesisaredifferent.Thelightneededforplantphotosynthesisisabout400-700nm.400-500nm(blue)lightand610-720nm(red)lightcontributedmosttophotosynthesis.     2.Blue(470nm)andred(630nm)LEDcanprovidejustthelightneededbyplants,sotheidealchoiceistousethecombinationofthesetwocolors.Invisualeffect,thecombinationofredandblueplantlightsshowpink.     3.Bluelightcanhelpplantphotosynthesistopromotegreenleafgrowth,proteinsynthesis,fruitformation;Redlightcanpromoteplantrhizomegrowth,contributetofloweringandfruitingandprolongfloweringperiod,playaroleinincreasingyield.     4.TheratioofredandblueLEDofLEDplantlampisgenerallybetween4:1and9:1,usually6-9:1.     5.Whenplantlampisusedtosupplylighttoplants,theheightofleavesisabout0.5-1meters.Continuousirradiationfor12-16hoursperdaycancompletelyreplacesunlight.     6.Theeffectisremarkable.Thegrowthrateisnearlythreetimesfasterthanthatofnaturalplants.     7.Solvetheproblemoflackofsunshineinwinteringreenhouse,promotechlorophyll,anthocyaninandcaroteneneededinplantphotosynthesis,sothatvegetablesandfruitscanbeharvested20%earlier,increasetheyieldby3to50%,increasethesweetnessofvegetablesandfruits,andreducepestsanddiseases.     8.LEDlightsourceisalsocalledsemiconductorlightsource.Thiskindoflightsourcehasnarrowwavelengthandcanemitlightofspecificwavelength,soitcancontrolthecoloroflight.Usingittoirradiateplantsalonecanimproveplantvarieties.     9.ThepowerofLEDplantgrowthlampislow,butitsefficiencyisveryhigh.Becauseotherlightsemitfullspectrum,thatistosay,sevencolors,whileplantsonlyneedredandbluelight,somostofthelightenergyoftraditionallampiswasted,sotheefficiencyisverylow.TheLEDplantgrowthlampcanemitthespecificredandbluelightneededbyplants,soitisveryefficient.ThisiswhythepowerofseveralwattsofLEDplantgrowthlampisbetterthanthatoftensorevenhundredsofwatts.     Anotherreasonisthelackofbluelightinthetraditionalsodiumlampspectrum,andredlightinthemercurylampandenergy-savinglampspectrum,sothetraditionallamplightcompensationeffectismuchworsethantheLEDlamp,andcomparedwiththetraditionallamptosavemorethan90%oftheelectricity,theoperationcostisgreatlyreduced.     AdvantagesofLEDPlantLamp:     1.Standardpowersocketconnectorsfordrivesorcoolingfansarenotrequired.     2.Theenvironmentofredandbluelightwavelengthisneededforplantgrowth.     3.Comparedwithothercommonlightingdevices,theLEDplantlamphasmildlightlineandwillnotburntheseedlings.     4.Comparedwithotherplantlightinglamps,itcansave10%~20%oftheelectricitycost.     5.Bluelightcanpromoteplantgrowth,whileredlightcanmakeplantsblossomandbearfruit.     24-hourhotline:15999793358(Weixinsamenumber)QQ:1780018226     Tel:0769-87285383-804     Fax:0769-87285383     Mailbox:ycw@taimingled.com     Address:No.9TengdaRoad,TengdaIndustrialPark,ZhangmuTown,DongguanCity,GuangdongProvince
LED Growth Plant Lamp Helps Medicinal Cannabis

LED Growth Plant Lamp Helps Medicinal Cannabis

In2018,theUnitedStates,Argentina,Australia,Austria,Chileandother35countrieshavelegalizedmedicalcannabis,whiletheUnitedKingdom,France,Belgium,NewZealandandotherninecountrieshavelegalizedsomemedicalcannabisdrugs.TheUnitedNationsCommissiononNarcoticDrugswillalsodiscusspureCBDandCBDpreparationsthatwillnotexceed0.2%THCandwillnotbeincludedintheinternationaldrugcontrolconventionsinanyway,whichisexpectedtopromotethelegalizationofglobalindustrialcannabis.AccordingtoBrightfieldGroup,aCBDMarketResearchcompany,thevalueoftheglobalCBDindustrywillreach$5.7billionin2019and$22billionin2022.     Cannabiscanbedividedintoindustrialcannabis,medicalcannabisandleisurecannabis,whichcontainTHC(tetrahydrocannabinol)andCBD(cannabisbisphenol).THCcanbindtoCB1receptorinthebrain,whichhasexcitingeffect;whileCBDhasnopsychoactiveeffect,highmedicalvalue,anti-spasm,anti-anxiety,anti-inflammation,analgesiaandotherpharmacologicaleffects.AconsiderablenumberofCBDdrugs,healthcareproductsandcosmeticshavebeensoldinEuropeanandAmericancountries.     Fohse,aNevada-basedhorticulturallightingsupplier,announcedanagreementwithCurativeCannabis,aCanadianmedicinalcannabisgrower,tosupplyplantgrowthlightstoitsOntarioplant.Theannualproductionofmedicinalcannabisisexpectedtoreach3000kg.Comparedwiththetraditionalhigh-pressuresodiumlamplightingsystem,usingLEDgrowthlights,thecompanyexpectstoincreasehempproductionandsaveabout50%ofenergy.     Withthedevelopmentofhempindustry,itisimperativetoreplacethehigh-voltagesodiumlampwithLEDgrowthlamp,whichusedtoconsumeenergyandcostelectricity.
What are the packaging methods of LED?

What are the packaging methods of LED?

Tools/rawmaterials Wafer,goldwire,bracket,silverglue,resin,dispensingmachine,wireweldingmachine,oven...etc.   Method/Step1: Lamp-LED(VerticalLED)   Lamp-LEDisadirect-plugLEDinitsearlystage.Itsencapsulationusesencapsulationmethod.ThefillingprocessistoinjectliquidepoxyresinintothecavityoftheLEDformingdie,thenpenetratethepressureweldedLEDbracket,putitintotheoventocuretheepoxyresin,andthenseparatetheLEDfromthecavityandformit.Becausethemanufacturingprocessisrelativelysimpleandlowcost,ithasahighmarketshare.SMD-LED(AppearanceMountedLED)   ThepatchLEDisaffixedtothePCBsurface,suitableforSMTprocessingandreflowsoldering.Itcanwelldealwiththeproblemsofbrightness,angleofview,smoothness,reliabilityandconsistency.ThelighterPCBboardandreflectivelayerdataareselected.Afterimprovement,theheaviercarbonsteeldatapinsofthedirect-insertedLEDareremoved,sothattheepoxytreewhichneedsfillinginthereflectivelayerisdisplayed.Fatless,theintentionistoreducethescale,reducethecomponent.Inthisway,theappearancemountedLEDcaneasilyreducetheproductweightbyhalf,andultimatelymaketheapplicationmorecomplete.   Method/Step2: Side-LED(SideLightEmittingLED)   Atpresent,anotherkeypointofLEDpackagingislight-emittingpackagingontheside.IfyouwanttouseLEDasbacklightsourceofLCD(liquidcrystaldisplay),thenthesidelightofLEDneedstobethesameastheexternallight,sothatthebacklightofLCDcanbeuniform.Althoughtheuseofwirerackdescription,canalsoreachthesideoftheintentofluminescence,buttheroleofheatdissipationisnotgood.However,Lumiledscreatedamirrordescription,usingthemirrorprincipletogeneratesidelight,andsuccessfullyappliedhigh-powerLEDstolarge-scaleLCDbacklightmodules.   Method/Step3: TOP-LED(TopLightEmittingLED) Toplight-emittingdiodesarecomparabletocommonpatchlight-emittingdiodes.Mainlyusedinmulti-functionalultra-thinmobilephonesandPDAbacklightsandstatusindicators.   Method/Step4: High-Power-LED InordertoobtainhighpowerandhighbrightnessLEDlightsource,manufacturersaredevelopinginthedirectionofhighpowerinthedescriptionofLEDchipsandpackaging.Atpresent,LEDpackagesthatcanacceptseveralWpowerhavebeenpresented.Forexample,thepackaginglayoutofNorluxserieshigh-powerLEDisamulti-chipcombinationofhexagonalaluminiumplateasthebase(makingitnon-conductive).Thebasediameteris31.75mm.Theluminousregionislocatedatthecenterofthebase.Itsdiameterisabout(0.375*25.4)mm.Itcancontain40LEDtubecores.Thealuminiumplateisalsousedasheatsink.Thiskindofpackageusesconventionalhighdensitypackagewithtubecore.Ithashighluminouspower,lowthermalresistanceandhighopticaloutputpowerunderhighcurrent.ItisalsoakindofLEDsolidstatelightsourcewithabrightfuture. ItcanbeseenthatthethermalcharacteristicsofpowerLEDdirectlyaffecttheworkingtemperature,light-emittingpower,light-emittingwavelengthandservicelifeoftheLED.Therefore,thepackagingdescriptionandmanufacturingskillsofpowerLEDchipsbecomemoreandmoreimportant.   Method/Step5: FlipChip-LED ThelayoutofLEDcladdingpackagingisbasicallymadeofapluralityofperforationsinPCB.Eachperforationononesideofthesubstrateisequippedwithtwodifferentareasandopencircuitconductivematerials.Moreover,theconductivematerialsarelaidflatonthesurfaceofthesubstrate.TherearepluralityofunpackagedLEDchipsplacedoneachperforationonthesideoftheconductivematerial.Atthehole,thepositiveandnegativecontactsofasingleLEDchipareconnectedwithconductivematerialsonthesurfaceofthesubstrateusingtinballsseparately.OntheperforatedsideofthepluralLEDchips,thereisasealantwithclearmaterialsonthesurface.Thesealantisahalf-sphereshapeandsitsateachperforation.Itisattributedtoflip-chipweldinglayoutoflightemittingdiodes.
How to Distinguish Positive and Negative Electrodes from Designation Photoelectricity in LED Light Emitting Diodes

How to Distinguish Positive and Negative Electrodes from Designation Photoelectricity in LED Light Emitting Diodes

HowdoLEDlightemittingdiodesdistinguishbetweenpositiveandnegativepoles?IntheapplicationprocessofLEDlightemittingdiodes,itisoftenencounteredhowtoidentifythepositiveandnegativepolesofLED.Thereasonwhythelightisnotbrightisthatthepositiveandnegativepolesareweldedintheoppositedirection.Thelightwillnotbebright.Nowwewillexpandourteachingtoidentifythepositiveandnegativepolesofallkindsoflight-emittingdiodes.   StrawCapLEDPositiveandNegativeElectrodes   ComparedwithpatchLED,strawcapLEDbeadshaveagooddistinctionbetweenpositiveandnegativepoles.TherearetwopiecesofpinsinsidetheLED.WecallthemLEDbrackets.Thenegativepolebracketsarelarger,becausethenegativepolebracketsareloadedwithLEDchips,andthepositivepolebracketsaresmaller.SothestrawcapLEDbeadsupportDalianconnectstheleadisnegative,thesupportsmalllinkleadispositive;thegeneralstrawcapLEDbead,wecanalsoseehispin,thegeneralpinshortisnegative,thepinlongispositive(ofcourse,thismethodonlyinthecaseofrelativelynewLEDbeads,pinsaresound,canbezoned.Therearemanywaystodetectthepositiveandnegativepolesofled.Themoreaccuratewayistousemultimeter.   Multimeterdetectionmethod.Whenusingthemultimetertodetectthelightemittingdiode,the"R*l0k"filemustbeused.We'vetalkedaboutitbefore.Thetubevoltagedropofthelightemittingdiodeis2V.Whenthemultimeterisin"R*lk"andtheresistorsbelowit,thebatteryinthemeterisonly1.5V.Itislowerthanthetubevoltagedrop.Nomattertheforwardorreverseaccess,thelightemittingdiodecannotbeturnedon,soitcannotbedetected.TheR*1ktimetableisequippedwith9V(or15V)highvoltagebattery,whichishigherthanthetubevoltagedrop,soitcanbeusedtodetectlightemittingdiodes.Whentesting,thetwopensareconnectedwiththetwoleadwiresofthelightemittingdiode,suchasthepinisdeflectedbyhalf,andthereisabrightspotinthelightemittingdiode,indicatingthatthelightemittingdiodeispositivelyconnected.Atthistime,thepositivepoleisconnectedwiththeblackpen(connectedwiththepositivepoleofthebatteryinthetable);andtheredpen(connectedwiththenegativepoleofthebatteryinthetable)isconnectedwiththeredpen(connectedwiththenegativepoleofthebatteryinthetable).Negativepole.Thenthetwopensarealignedandconnectedwiththelight-emittingdiode.Atthistime,thecounterneedleshouldnotmove.Ifthemeterneedleisdeflectedtotheheadordoesnotmoveregardlessoftheforwardorreverseaccess,thelightemittingdiodeisdamaged.   Judgingpositiveandnegativepolesof5050patchLED   5050patchLEDisacommonlyusedpatchLEDinLEDenergy-savinglamplightingindustry,butmanyusersdonotknowhowtoweldwhentheyget5050patchled.Thereasonisthattheydonotknowhowtodistinguishthepositiveandnegativeof5050patchled.Todaywewilltellyouhowtodistinguishthepositiveandnegativeof5050patchled.Weusetheformofpictures.Let'sintroduceitintuitively.Ihopeitwillbehelpfultoyouall!__________.   Thewhole5050patchLEDissquare.Oneofthefourrightangleshasasmallanglewithasmallgap,whichistheplacewheretheredcircleisontheway.Otherrightangleshavenosmallangle.Theonewithasmallangleisthenegativepoleandtheotheristhepositivepole.Fordetails,pleaseconsultTaiwanTaimingOptoelectronics-ChengLi159998297-ChengLi(Weixinidenticalnumber).)QQ:3079986507
Analysis of Manufacturing Process and Testing Items of LED Chips

Analysis of Manufacturing Process and Testing Items of LED Chips

ChipisthemostcriticalrawmaterialofLED.ItsqualitydirectlydeterminestheperformanceofLED.Especiallyforhigh-endLEDusedinautomotiveorsolid-statelightingequipment,thereisabsolutelynodefect,thatistosay,thereliabilityofsuchequipmentmustbeveryhigh.However,duetothelackofexperienceandequipmentinchipincominginspection,LEDpackagingfactoriesusuallydonotcarryoutincominginspectiononchips.Afterpurchasingunqualifiedchips,theyoftensufferfromdumblosses.OnthebasisofaccumulatingalargenumberoffailureanalysiscasesofLED,JinjianInspectionintroducesthebusinessofincominginspectionofLEDchips,andidentifiestheadvantagesanddisadvantagesofthechipsbyusinghigh-endanalyticalinstruments.ThistestingservicecanbeusedasasupplementtotheincominginspectionofLEDpackagingplant/chipagentfactory,topreventbadchipsfrombeingstoredinstorage,andtoavoidtheoveralllossoflampbeadscausedbychipqualityproblems.   Testingitems:   I.TestingofPerformanceParametersofChips   Wd(mainwavelength),Iv(brightness),Vf(forwardvoltage),Ir(leakage),ESD(antistaticability)andotherchipphotoelectricperformancetesting,Jinjianasathird-partytestingagencycanidentifywhethertheproductdataprovidedbysuppliersmeetthestandards.   II.ChipDefectFinding   Detectioncontent:   1.Chipsizemeasurement,chipsizeandelectrodesizemeettherequirements,whethertheelectrodepatterniscomplete.   2.Whetherthechiphasdefectssuchassolderjointcontamination,solderjointbreakage,grainbreakage,graincuttingsizedifference,graincuttinginclination,etc.   ThedamageoftheLEDchipwilldirectlyleadtothefailureoftheLED,soitisveryimportanttoimprovethereliabilityoftheLEDchip.Thespringclampissometimesusedtofixthechipintheevaporationprocess,sotheclampmarkswillbeproduced.Inyellowlightoperation,ifthedevelopmentisincompleteandthereareholesinthehood,therewillberesidualmetalintheluminousregion.Inthepreviousstageofgrainproduction,tweezers,flowerbasketandcarriermustbeusedinallprocessessuchascleaning,evaporation,yellowlight,chemicaletching,fusionandgrinding,soscratchingofgrainelectrodeswilloccur.   Theinfluenceofchipelectrodesonsolderjoints:theimproperevaporationofchipelectrodesleadstothelossordamageofelectrodesaftersolderingwires;thepoorsolderabilityofchipelectrodesleadstovirtualsolderingofsolderballs;improperstorageofchipleadstooxidationofelectrodesurface,surfacecontaminationandsoon.Theslightcontaminationofbondingsurfacemayaffectthemetaloriginbetweenthetwo.Subdiffusioncausesfailureorvirtualwelding.   3.DefectFindinginChipEpitaxyZone   Intheprocessofhightemperaturecrystallization,impuritieswillbeintroducedintothesubstrate,sedimentresidueintheMOCVDreactionchamber,peripheralgasandMosource.Theseimpuritieswillpenetrateintotheepitaxylayer,preventthenucleationofGaNcrystal,formvariousepitaxydefects,andeventuallyformtinypitsonthesurfaceofepitaxylayer,whichwillseriouslyaffecttheepitaxy.Crystalqualityandpropertiesofextendedfilmmaterials.Jinjianhasdevelopedafastdetectionmethodtoidentifythedefectsofchipepitaxy.Itcandetect80%ofthedefectsofchipepitaxylayeratlowcostandquickly,andhelpLEDcustomerschoosehighqualityepitaxychipsandchips.   4.Observationofchiptechnologyandcleanliness   ElectrodeprocessingisakeyprocessintheproductionofLEDchips,includingcleaning,evaporation,yellowlight,chemicaletching,fusion,grinding,willbeexposedtomanychemicalcleaningagents,ifthechipcleaningisnotcleanenough,willcauseharmfulchemicalresidues.TheseharmfulchemicalswillreactelectrochemicallywiththeelectrodeswhentheLEDiselectrified,leadingtodeadlights,lightdecay,dark,blackeningandotherphenomena.Therefore,theidentificationofchipchemicalresiduesisveryimportantforLEDpackagingplants.   Caseanalysis(1):   Acustomerredlightbulbfounddarkproblem,buthasbeenunabletofindthereason,commissionedJinjiananalysisofthereasonsforfailure.Aftereliminatingthepackagingreasonsthroughaseriesofinstrumentalanalysis,Jinjianinspectedthebarecrystalsprovidedbythesupplier.Itwasfoundthattherewerecontaminantsindifferentareasineachchip'sluminousregion.EnergyspectrumanalysisshowedthatthecontaminantscontainedCandOelements,indicatingthatthecontaminantswereorganic.Werecommendthatcustomerspayattentiontotheassessmentofchipmanufacturers'productionprocessspecificationsandworkshopenvironment,andstrengthentheinspectionofchipincomingmaterials.     Note:ManufacturingprocessofLEDchip       Epitaxialfilmcleaningcoatingoftransparentelectrodelayercoatingoftransparentelectrodelayerphotolithographyoftransparentelectrodepatterncorrosionde-coatingde-gluephotolitlithoglitlitlithoglitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitlitGrinding_Cutting_Chip_FinishedProductTesting.   Afterthegrowthoftheepitaxychip,thenextstepistomaketheelectrodesfortheLEDepitaxychip(Ppole,Npole),thencuttheLEDepitaxychipwithalaseroradiamondknife,makethechip,andthenextract
Advantages, Advantages and Disadvantages of LED Lamps

Advantages, Advantages and Disadvantages of LED Lamps

CharacteristicsofLEDLightSource:     _Voltage:LEDuseslow-voltagepowersupply,powersupplyvoltageisbetween1.8and3.6V,accordingtodifferentproducts,soitisasaferpowersupplythanusinghigh-voltagepowersupply,especiallysuitableforpublicplaces._Efficiency:Energyconsumptionis80%lessthanthatofincandescentlampswiththesamelightefficiency  4.  光衰:随着科技的进步,光衰越来越小。Atpresent,thelightattenuationofordinaryLEDlampswithin1,000hourscanbereallycontrolledwithin5%,evenaftermorethan1,000hours,thelightattenuationisverysmall.5.Environmentalprotection:noradiation,nopollution,realenvironmentalprotectionmaterials.LEDproductsaregenerallyexemptfrominspectionwhenexporting     DimensionalknowledgeofLEDchips:     Accordingtotheshapeclassification,chipsaregenerallydividedintowafersandsquares.Amongthem,thewaferisrelativelylow-gradeanditsperformanceisnotstable.OurcompanygenerallydoesnotusetheLEDproducedbythewafer;thesquareisgenerallymeasuredbysize,suchas12mil(1mil=0.0254squaremillimeter).Generallyspeaking,thelargerthechipsize,thehigherthebrightnessofthesamebrandchip.Ourcompany'smostcommonlyusedLEDbeads,redandyellowlightingeneral9-12mil,white,blueandgreenlightingeneral12-14mil,whichisalsothemostcommonlyusedchiponthemarket,iflargerchips,brightness,althoughitcanimprovealot,butthepriceofchipshasgreatlyincreased,whichiswhysizechipsarerarelyused.     CommonknowledgeofLEDcolor:     ThedifferentcoloursofLEDaredeterminedbythechipswithdifferentwavelengths.Forexample,redlightchipsareusually620-630nm(nanometer),greenlightchipsare527nm,bluelightchipsare470nm,yellowlightchipsare585nm,andwhitelightchipsarealsobluelightchips,onlyaddingappropriateamounttobluelightchips.Thephosphorglowswhite.     ClassificationofLED;     Accordingtothesizeofpower;canbedividedintosmallpower,highpower(industrygenerallymorethan0.5Wlampiscalledhigh-powerlamp).Accordingtotheform:canbedividedintodirectinsertiontypeandpatchtype.StrawcapLEDcanbedividedintoF3(3mmwhenthelampheadisdiameter),F5(5mmwhenthelampheadisdiameter);oraccordingtotheshapeofthelamphead,itcanbedividedintoboundless,thin,thick,round;accordingtowhetherthelampheadistransparentornot,itcanbedividedintotransparent,foggy...Moremethodsofsubdivisionarenotenumerated.Theabovelistisbasedonourfrequentuse.PiranhaLEDcanalsobedividedintoF3accordingtothesizeofthelamphead.F5canbedividedintoroundhead(i.e.themostcommonlyusedpiranhalamp)andflathead(thiskindofheadisveryspecial,itsluminousangleiscloseto180degrees,whichiscommonlyusedinsituationsrequiringastigmatism).SmallpowerpatchLEDcanbedividedinto0805,1206,2835,3020,3528,50accordingtothesizeofthelamphead.50or5060(5050and5060areverysmalldifferences,nakedeyeisdifficulttodistinguish,notprofessionalcustomerscanbecalledaccordingtohishabits).Ourcompanyoftenuses2835,3528,5050.High-powerLEDisgenerallydividedbypower,thecommonis0.5W,1W,3W,5W,ourcompanycommonlyusedis1W.     CommonknowledgeofthenumberofchipofLED;     ThemostcommonuseofthesameLEDlampisonlyonechip,butunderspecialcircumstances,itcanusetwooruptofourchips,suchas:astrawhatlampcanuseoneortwochips(consideringitssmallsize,inconvenientheatdissipation,resultinginperformanceinstability,generallyonlyoneortwochips);apiranhalampcanbeused.Withone,two,three,fourchips,ourcompanymostcommonlyusedisoneandtwochips;patch3528lampcanuseone,two,threechips(ourcompanyoftenusesone,twoelderbrotherchips),patch5050generallyusesthreechips,especiallydescription;patchlampwiththreechipsis,therearetwosituations:1,threechipsoftheface.Thecolourisexactlythesame.2.Thethreechipsarered,greenandblue,whichweoftencallRGBlamps.     ViewingangleofLED;     Themostcommonlight-emittingangleofthedirect-plugLEDis120degrees,andthespecialonecanbe45degreesor15degrees.Ourcompany'scommonlyuseddirectinsertiontypeisgenerally120degrees,siliconelampis45degrees,patchtypeisgenerally120degreesoflight-emittingangle;     CommonknowledgeofvoltageofLED;     Asinglelow-powerLEDlamp(includingplug-inorpatchtype).Thecurrentallowedoneachchipshouldnotbehigherthan20milliamperes;thecurrentallowedoneachdual-chiplampshouldnotbehigherthan20milliamperes;similarly,thecurrentallowedoneachthree-chiplampshouldnotbehigherthan60milliamperes.     2.High-powerLED,ourcompanyhasadopted1W,themaximumcurrentallowedtopassthroughis150mA.     CommonsenseofLEDintensity;     1.Candlelight,InternationalCandlelight,DefinitionofCandela     Atthestandardatmosphericpressureof101,325Newtonspersquaremetre,theabsolute"blackbody"withanareaequalto1/60squarecentimeters(i.e.anidealobjectthatabsorbsallexternallightwithoutreflecting)hasaverticalluminousangleof1Candelawhenthesolidificationtemperatureofpureplatinum(about2042K)is1769degreeC.Moreover,thethreeconceptsofcandlelight,internationalcandlelightandCandelaaredifferentandshouldnotbeequated.Intermsofquantity,60candlesequals58.8internationalcandles,and1candlelightofHefnerlampequals0.885internationalcandlesor0.919candles.     2Luminescentintensityandbrightness:Luminescentintensityisabbreviatedaslightintensity.Theinternationalunitiscandela(Candela)abbreviationcd.Lcdreferstotheluminousfluxemittedbythel
Manufacturing process of LED lamp beads - table inscription

Manufacturing process of LED lamp beads - table inscription

I.ProductionprocessofLEDlampbeads 1.Production: A)Cleaning:PCBorLEDbracketiscleanedbyultrasonicwaveanddried.   B)Mounting:AfterthebottomelectrodeofLEDtubecore(largewafer)isequippedwithsilverglue,theexpandedtubecore(largewafer)isplacedonthespinningtable.Underthemicroscope,thetubecoreismountedonebyoneonthecorrespondingpadofPCBorLEDbracket,andthensinteredtosolidifythesilverglue.   C)Pressurewelding:TheelectrodesareconnectedtothecoreoftheLEDtubewithanaluminiumwireoragoldwireweldertoactasaleadforcurrentinjection.LEDisdirectlyinstalledonPCB,generallyusingaluminiumwireweldingmachine.(GoldwirewelderisrequiredforwhiteTOP-LEDproduction)   D)Packaging:LEDcoreandweldingwireareprotectedbydispensingandepoxy.TherearestrictrequirementsfortheshapeofthecuredcolloidwhendispensingglueonPCBboard,whichisdirectlyrelatedtothebrightnessofbacklightproducts.Thisprocesswillalsoundertakethetaskofpointphosphor(whiteLED).   E)Welding:IfthebacklightisSMD-LEDorotherencapsulatedLED,theLEDneedstobeweldedtothePCBboardbeforetheassemblyprocess.   F)Filmcutting:variousdiffusionfilmsandreflectivefilmsneededforcuttingbacklightsourcewithpunchdie.   G)Assembly:Accordingtotherequirementsofthedrawings,thebacklightmaterialsaremanuallyinstalledinthecorrectposition.   H)Testing:Checkthephotoelectricparametersofbacklightandtheuniformityoflightoutput.   2.Packaging:Packingandwarehousingfinishedproductsasrequired.   II.PackagingTechnology   1.TasksofLEDpackaging ItconnectstheexternalleadstotheelectrodesoftheLEDchip,protectstheLEDchipandimprovestheefficiencyoflightextraction.Thekeyprocessesaremounting,pressureweldingandpackaging.   2.LEDPackagingForm LEDpackagingcanbesaidtobeavarietyofforms,mainlyaccordingtodifferentapplicationoccasionstousethecorrespondingsize,heatdissipationcountermeasuresandlightingeffect.LedsareclassifiedasLamp-LED,TOP-LED,Side-LED,SMD-LED,High-Power-LEDandsoon.   3.LEDpackagingprocess   A)ChipInspection Microscopicexamination:Whetherthematerialsurfaceismechanicallydamaged,whetherthesizeoflockhillchipandthesizeofelectrodemeetthetechnologicalrequirements,andwhetherthepatternofelectrodeiscomplete.   B)Expansion BecauseLEDchipsarestillarrangedtightlyafterscratching(about0.1mm),itisnotconducivetotheoperationofthelaterprocess.Weuseexpandertoexpandthefilmofthebondingchip.ThedistancebetweentheLEDchipsisstretchedtoabout0.6mm.Manualexpansioncanalsobeused,butitiseasytocausebadproblemssuchaschipdroppingandwaste.   C)dispensing SilverglueorinsulatingglueatthecorrespondingpositionofLEDbracket.(ForGaAsandSiCconductivesubstrates,red,yellowandyellow-greenchipswithbackelectrodesaremadewithsilverglue.ForblueandgreenLEDchipsonsapphireinsulatedsubstrates,insulatingglueisusedtofixthechips.)Thetechnicaldifficultyliesinthecontrolofdispensingquantity,andtherearedetailedtechnicalrequirementsincolloidheightanddispensingposition.Assilverglueandinsulatinggluehavestrictrequirementsinstorageanduse,thewake-up,stirringandusetimeofsilverglueareallmattersneedingattentionintechnology.   D)Incontrasttodispensing,thegluepreparationmachinefirstcoatsthesilverglueonthebackelectrodeoftheled,andtheninstallstheLEDwithsilverglueonthebackbracket.Theefficiencyofgluepreparationismuchhigherthanthatofdispensing,butnotallproductsaresuitableforgluepreparationprocess.   E)TheexpandedLEDchip(glueornon-glue)isplacedonthefixtureofthepiercingtablebyhand.TheLEDbracketisplacedunderthefixture.Underthemicroscope,theLEDchipisprickedonebyonetothecorrespondingpositionwithaneedle.Comparingwithautomaticmounting,manualspinninghasoneadvantage.Itisconvenienttoreplacedifferentchipsatanytime.Itissuitableforproductsthatneedtoinstallmultiplechips.   F)Automaticmounting Infact,automaticmountingcombinestwostepsofgluedipping(dispensing)andchipinstallation.First,silverglue(insulatingglue)isappliedontheLEDbracket,thentheLEDchipissuckedupandmovedbyvacuumsuctionnozzle,andthenplacedonthecorrespondingbracketposition.Intheprocessofautomaticmounting,weshouldbefamiliarwithequipmentoperationprogramming,andadjustthegluestainingandinstallationaccuracyoftheequipment.BakelitesuctionnozzlesshouldbeselectedasfaraspossibleintheselectionofsuctionnozzlestopreventdamagetothesurfaceofLEDchips,especiallyforblueandgreenchips.Becausethenozzlewillscratchthecurrentdiffusionlayeronthechipsurface.   G)Sintering Thepurposeofsinteringistosolidifysilverglue.Sinteringrequirestemperaturemonitoringtopreventbadbatchperformance.Thesinteringtemperatureofsilverglueisgenerallycontrolledat150Candthesinteringtimeis2hours.Accordingtotheactualsituation,itcanbeadjustedto170Cfor1hour.Insulationglueisgenerally150C,1hour.Silvergluesinteringovenmustbeopenedandreplacedatintervalsof2hours(or1hour)accordingtothetechnologicalrequirements,andshouldnotbeopenedatwill.Sinteringovenshouldnotbeusedforotherpurposestopreventpollution.   H)PressureWelding ThepurposeofpressureweldingistoleadtheelectrodestotheLEDchipandcompletetheconnectionbetweentheinternalandexternalleadsoftheproduct. TherearetwokindsofpressureweldingprocessesforLED:goldwireballweldingandaluminiumwirewel
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Time of issue:2019-05-17 00:00:00

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Time of issue:2019-05-17 00:00:00

Service hotline

0769-87285383

Welcome your consultation!

Messages

xh

Copyright © Dongguan Taiming Photoelectric Technology Co., Ltd. All Rights Reserved. 粤ICP备15044056号-2

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